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3D InCites Member Spotlight: How Advanced Packaging is Transforming the Semiconductor Landscape
3D InCites Podcast
The 3D InCites Member Spotlight episode features exclusive conversations with industry leaders at IMAPS Device Packaging Conference 2025, exploring the cutting-edge of semiconductor packaging innovation and domestic manufacturing expansion.
• Rex Anderson of Micross details their RESHAPE program funding and Integra acquisition, establishing them as North America's largest domestic OSAT
• Calvin Cheung of ASE explains how advanced packaging enables AI infrastructure while reducing power consumption by 40-60% through vertical power delivery. He also describes silicon photonics emerging as a game-changer for data transmission, using light instead of electrons for faster, more energy-efficient signal integrity
• Keith Felton of Siemens discusses digital twin technology allowing early predictive analysis during package prototyping to prevent costly downstream engineer change orders - or ECOs.
• Vahid Akhavan highlights PulseForge's photonic debonding technology partnerships for clean, high-yield wafer release
• Bernd Krafthoefer and Florian Lechner, ERS Electonic representatives, share insights on their new European competence center and sub-micron photonic debonding capabilities for 300mm wafers.
Join us next week as we explore supply chain resilience in the semiconductor capital equipment sector with Barry O'Dowd from Kuehne+Nagel and special guest Kamal Aluwalia, CEO of Resilinc. Learn more about member benefits at 3DInCites.com/memberships.
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