This week, we’re wrapping up our conversations from the IMAPS International Symposium, with an extended episode. The questions I’m asking? How have the events of the last 18 months impacted the future of the semiconductor industry, and what are the three things we should be focusing on in advanced packaging right now?
You’ll hear from Jan Vardaman of TechSearch International; Ram Trichur of Henkel Corporation; Curtis Zwenger of Amkor Technology; Robert Avila, Finetech; Jon Medernach, MRSI; Dhiraj Bora, Silitronics; and Craig North, GelPak.
How have the events of the last 18 months impacted the future of the semiconductor industry?
Top of everyone’s mind for question one are things like adjusting to working from home, how tool suppliers adjusted their manufacturing, how the industry thrived despite the challenges, returning to in-person events and what that looks like, securing the semiconductor supply chain, sustainable semiconductor manufacturing, the geopolitical situation, the push to onshoring manufacturing to the US, rebuilding the microelectronics workforce.
What are the three things we should be focusing on in advanced packaging right now?
The importance of collaboration and consortia for heterogeneous integration; silicon photonics; chiplet integration and the need for standardization; increased package size and the implications for materials; advanced node technologies making it to the automotive industry, and much more.
You can connect with today’s speakers on LinkedIn.
* 3D InCites Community MembersKiterocket
If you liked Part 1 of Conversations from the IMAPS Symposium, you’re going to love part 2. While my questions are the same, the responses are quite varied. In this episode, you’ll hear from Andy Mackie of Indium Corporation, and Dirk Friebel, of Fraunhofer Institute, as we wrap up Day one of coverage. We’ll also give you a sneak peek of Day 2 with a conversation with Tom Gregorich of Zeiss Process Control Solutions.
So what are these questions? First, I asked how the events of the last 18 months have shaped the future of the semiconductor industry. Second, I asked what are three things that are impacting advanced packaging right now. In this episode, these questions sparked conversation around navigating through the pandemic, the return to in-person events, Fraunhofer’s presence in the USA and what it means, how electric vehicles are impacting advanced packaging requirements, who’s going to handle chiplet assembly, advancements in thermal interface materials, the need for inline X-ray inspection for high volume manufacturing, and all sorts of other things.
Thank you to today’s guests! Here’s where you can find them on LinkedIN:Kiterocket
We’re changing things up a bit for the next few weeks with a series of podcast episodes recorded live at the IMAPS International Symposium in San Diego. How we've missed those live events and the hallway conversations! We figured you did too, so we convinced some of our colleagues to sit down with Françoise and record them.
In this first episode, we talk with two of the panelists from Monday night’s Diversity and Inclusion Town Hall. Nicole Wongk of Honeywell is putting her chemical engineering background to work in advanced packaging and assembly. She's active in the company's Diversity and Inclusion initiative. Marqus Patton, a software analyst at Accenture Federal Service, is VP of the San Diego Chapter of the National Society of Black Engineers.
Next, I spoke with Cadence’s KT Moore, who delivered the only In-person keynote. KT is very active in Cadence’s DEI efforts, so we talked a bit about that before diving into the two questions that I asked everyone I spoke with – how have the events of the last 18 months shaped the future of the semiconductor industry. And what are the three things happening in Advanced Packaging right now that we should be watching? Everyone had something different to say – the next two episodes will feature the rest of those conversations. Here we go….
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