In this episode, Françoise speaks with Beth Keser, Ph.D., about her latest book co-authored with Steffen Kröhnert, ESPAT Consulting.
Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces was published in December 2021. It is essentially a companion to the wafer-level packaging handbook titled, Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies, which the duo published in 2019. This book picks up where the first one left off, with 11 new chapters including contributions from some of the same companies that participated before, as well as new ones.
The book examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges, and is filled with contributions from some of the field’s leading experts.
In the interview, Beth talks about the book’s backstory, why and how it was written, and who participated. She also explains why they decided to begin the book with a market report, and how the book is a snapshot in time.
Contact Beth Keser on LinkedIn
Order your own copy of Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces.
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According to the International Energy Agency, road transportation accounts for 16% of global emissions. Electric vehicles are the key technology to decarbonize this. The EIA estimates that EVs will account for 13% of new cars sold in 2022. Many countries are setting goals to eliminate combustion engine cars to reach Net Zero emissions by 2050. But there are a lot of challenges to iron out before EVs achieve critical mass. For example, one area of interest for this week’s podcast guests is the materials used to manufacture EV power modules.
In this episode, Françoise von Trapp talks with Indium’s Pei Lim and Dean Payne about these challenges, particularly why pressure silver sintering is becoming a popular approach for die attach in power packaging applications.
You’ll learn how eMobility has impacted manufacturing power modules and the origin of silver sintering in these devices. You’ll learn about the materials currently used in sintering, and why silver is a better choice for electric vehicles. Lastly, you’ll learn about Indium’s pressure sinter offering and its benefits.
Learn more about pressure silver sintering here.
Contact today’s guests on LinkedIn:
Sze Pei Lim, Senior Global Product Manager, Indium Corporation
Dean Payne, Semiconductor Product Manager, Indium Corporation.
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For this episode, recorded during the IMAPS International Symposium, Françoise von Trapp hands over the mike to Robin Davis, of 3D InCites Member company, Deca.
Davis organized and moderated a Diversity, Equity, and Inclusion town hall discussion during IMAPS, on the topic of Equality vs. Equity. A distinguished panel of industry veterans shared their perceptions and personal stories, including Jean Trewhella, GlobalFoundries; Susan Trulli, Raytheon; Shelby Nelson, Mosaic Microsystems; Urmi Ray, Saras Micro Devices, and KT Moore, Cadence.
Davis provided a framework for the conversation, explaining the difference between Equal and Equity: Equality means each employee gets the same bicycle to ride, and equity means that everyone gets the bicycle that suits their needs. The panelists then also offered tips for how to overcome our own unconscious bias to create a culture of DEI at our own workplaces.
Contact the Panelists on LinkedIn
Robin Davis, Deca
Jean Trewhella, GlobalFoundries
Susan Trulli, Ratheon
Shelby Nelson, Mosaic Microsystems
Urmi Ray, Saras Microdevices
KT Moore, Cadence
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25 of our community members participated in the 2022 IMAPS International Symposium in Boston, MA, which was held during the first week of October. This episode features conversations about what they were presenting and showcasing, and what they learned during the week.
Craig North, of Gel-Pak, is on a mission to find out as much as he can about chiplet processes and technology, to identify gaps that can be filled by Gel Pak products and services.
Bob Connor and Kevin Oswalt of X-Celeprint. Kevin talked about the paper he presented at IMAPS on micro-transfer printing (MTP) at the conference and creating the III_V heterogeneous integration ecosystem.
Bill Acito, of Member company Siemens, presented on silicon substrate design for BGA designers.
Carlotta Baumann, the new CEO of Finetech, talks about stepping into the role in the midst of COVID, and into the shoes of a 22-year veteran not only as a woman but as the sole owner of the company.
Tim Olson, CEO of Deca, was awarded the IMAPS Founder Award. To celebrate, we took a walk down memory lane to share Deca’s origin story and how the company has evolved over the years.
Casey Krawiec and Tim Going of StratEdge Corporation, talked about the new die-on-tab service they are offering for customers who want to incorporate GaAn die into hybrid packaging. They’ve got some interesting products coming down the pipelines in space and defense applications.
Keith Best, of our member company Onto Innovation, talked about the company’s presentation on RDL inspection, which is difficult to inspect because of metal grain. He explained how Onto Innovation’s ClearFind technology uses a green laser to make metal black and organics white, to make the defects easier to see.
Dick Otte, QP Technologies, returns to the podcast to offer some insight on the CHIPS and Science Act. He talks about who customers will be as an outcome of the government investment, and what can be done to take advantage of them,
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in this episode, Françoise von Trapp interviews three of the keynote speakers who presented during the 2022 IMAPS International Symposium. Featured guests include Lionel Kimmerling, Dr. Anu Agarwal (MIT Microphotonics Center); Glenn Daves (NXP), and Dave Bolognia (Analog Devices).
We’re back on the road – recording a series of episodes at the IMAPS International Symposium. In this first episode, Françoise interviews some of the keynote speakers to capture the highlights of their talks.
First up, is Lionel Kimmerling, Thomas Lord Professor of Materials Science and Engineering Director at MIT Microphotonics Center, and his colleague, Dr. Anu Agarwal, MIT – Director of Electric Photonic Packaging and principal research scientist. They explain the basics of Si photonics and co-packaged optics, and the advantages and opportunities of electronic-photonic package integration, which is expected to be the next big technology transition in the IC field, particularly when it comes to chip stacking.
Additionally, Dr. Agarwal talks about a partnership between the Microphotonics Center and IMAPS to provide an educational setting to provide hands-on-training to help the packaging engineer workforce to develop the new skills
Glenn Daves of NXP gave the keynote on Day 2 on the topic of 6G – It’s Opportunities and Packaging Challenges. He talks about the promise of 6G and why it’s more than just another “G” and explains what the plans are for 6G applications. We also talk about all that needs to be accomplished to stay on track to integrate 6G into the wireless offerings, and what’s needed specifically from the packaging community t support it. Lastly, he talks about the importance of semiconductor sustainability and the opportunity to design sustainability into 6G from the get-go.
Dave Bolognia of Analog Devices talks about advancing medical electronics at the intelligent edge. He explains what he means by the intelligent edge; how data volumes are driving the need for more processing at the edge, and the medical applications that will benefit from it.
Contact Our Guests:
Lionel Kimmerling, MIT Microphotonics Center
Anu Agarwal, Ph.D., MIT Microphotonics Center
Glenn Daves, NXP Semiconductors
Dave Bolognia, Analog Devices
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It’s no secret that semiconductors are very much a male-dominated industry. In fact, according to Zippia, only 10.7% of engineers working in the semiconductor industry are women. And according to Deloitte and Touche’s Women in the Workplace, women are still vastly underrepresented at all levels of management. In this episode, Françoise von Trapp talks with Christine Whitman, a semiconductor executive who has broken through these barriers. She’s the chairman and CEO of our member company. Mosaic Microsystems.
In this episode, Christine shares her origin story. She talks about what inspired her to pursue a career in semiconductors, and the career path she took that resulted in her buying her first company. A self-described serial entrepreneur, she talks about her passion for materials science, what she looks for when investing in a start-up, and what led her to found Mosaic Microsystems. She also shares her vision for the future, and advice for women looking to shatter the glass ceiling.
About Mosaic Microsystems
Mosaic is pioneering thin glass for packaging and interposer applications in fields ranging from millimeter-wave communications to artificial intelligence and photonics. Thin glass has outstanding mechanical and electrical properties for today’s packaging applications, but adoption has been slow due to its fragility and flexibility. Mosaic’s Viaffirm handling solution eliminates these roadblocks by making thin glass compatible with standard semiconductor processes. Viaffirm also provides a platform for through glass vias and void-free via fill, enabling glass-based interposers with capabilities normally reserved for silicon.
Learn more about Christine Whitman here.
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This week, we’re wrapping up our conversations from the IMAPS International Symposium, with an extended episode. The questions I’m asking? How have the events of the last 18 months impacted the future of the semiconductor industry, and what are the three things we should be focusing on in advanced packaging right now?
You’ll hear from Jan Vardaman of TechSearch International; Ram Trichur of Henkel Corporation; Curtis Zwenger of Amkor Technology; Robert Avila, Finetech; Jon Medernach, MRSI; Dhiraj Bora, Silitronics; and Craig North, GelPak.
How have the events of the last 18 months impacted the future of the semiconductor industry?
Top of everyone’s mind for question one are things like adjusting to working from home, how tool suppliers adjusted their manufacturing, how the industry thrived despite the challenges, returning to in-person events and what that looks like, securing the semiconductor supply chain, sustainable semiconductor manufacturing, the geopolitical situation, the push to onshoring manufacturing to the US, rebuilding the microelectronics workforce.
What are the three things we should be focusing on in advanced packaging right now?
The importance of collaboration and consortia for heterogeneous integration; silicon photonics; chiplet integration and the need for standardization; increased package size and the implications for materials; advanced node technologies making it to the automotive industry, and much more.
You can connect with today’s speakers on LinkedIn.
* 3D InCites Community Members
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If you liked Part 1 of Conversations from the IMAPS Symposium, you’re going to love part 2. While my questions are the same, the responses are quite varied. In this episode, you’ll hear from Andy Mackie of Indium Corporation, and Dirk Friebel, of Fraunhofer Institute, as we wrap up Day one of coverage. We’ll also give you a sneak peek of Day 2 with a conversation with Tom Gregorich of Zeiss Process Control Solutions.
So what are these questions? First, I asked how the events of the last 18 months have shaped the future of the semiconductor industry. Second, I asked what are three things that are impacting advanced packaging right now. In this episode, these questions sparked conversation around navigating through the pandemic, the return to in-person events, Fraunhofer’s presence in the USA and what it means, how electric vehicles are impacting advanced packaging requirements, who’s going to handle chiplet assembly, advancements in thermal interface materials, the need for inline X-ray inspection for high volume manufacturing, and all sorts of other things.
Thank you to today’s guests! Here’s where you can find them on LinkedIN:
· Andy Mackie, Indium Corporation
· Dirk Friebel, Fraunhofer Institute
· Tom Gregorich, Zeiss Process Control
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We’re changing things up a bit for the next few weeks with a series of podcast episodes recorded live at the IMAPS International Symposium in San Diego. How we've missed those live events and the hallway conversations! We figured you did too, so we convinced some of our colleagues to sit down with Françoise and record them.
In this first episode, we talk with two of the panelists from Monday night’s Diversity and Inclusion Town Hall. Nicole Wongk of Honeywell is putting her chemical engineering background to work in advanced packaging and assembly. She's active in the company's Diversity and Inclusion initiative. Marqus Patton, a software analyst at Accenture Federal Service, is VP of the San Diego Chapter of the National Society of Black Engineers.
Next, I spoke with Cadence’s KT Moore, who delivered the only In-person keynote. KT is very active in Cadence’s DEI efforts, so we talked a bit about that before diving into the two questions that I asked everyone I spoke with – how have the events of the last 18 months shaped the future of the semiconductor industry. And what are the three things happening in Advanced Packaging right now that we should be watching? Everyone had something different to say – the next two episodes will feature the rest of those conversations. Here we go….
Contact our Speakers on Linked In:
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