Arizona is transforming into the "Silicon Oasis" of America through an unprecedented collaboration that's reshaping semiconductor education from high school through graduate studies. At the heart of this revolution is a groundbreaking partnership between the University of Arizona and Chandler Unified School District, launching the nation's first high school career and technical education program focused on semiconductor manufacturing.
Starting July 2025, forty students will begin a two-year journey learning on industry-grade equipment—not "glorified children's toys" but actual mechatronic systems, universal robots, and PCB printing technology. What makes this program revolutionary is its design for multiple pathways; graduates can either enter the workforce immediately as technicians or continue to higher education with college credits already earned.
Meanwhile, Arizona State University is building the advanced end of this educational pipeline through CHIPS Act-funded initiatives like the Southwest Advanced Prototyping Hub and the SHIELD project. Graduate courses in semiconductor packaging have exploded in popularity, growing from just 27 students to over 175 in two years. The university is getting creative with outreach too, developing a "Packaging on Wheels" mobile facility to bring semiconductor education to schools nationwide.
The strength of Arizona's approach lies in its extensive industry involvement. Fifteen major companies form the steering committee for the high school program, providing real-world problems and case studies. Students from diverse backgrounds—electrical, mechanical, materials science, and chemical engineering—all find pathways into this multidisciplinary field.
As one industry expert notes, students with hands-on, industry-specific training demonstrate markedly better performance both during interviews and on the job. This educational ecosystem is creating not just the chips of tomorrow, but the workforce that will design, build, and innovate them.
Contact Our Guests on LinkedIn:
- Scott Hayes, NXP
- Liesl Folks, University of Arizona
- Janet Hartkopf, Chandler Unified School District
- Chris Bailey, ASU
- Pallavi Praful, ASU
- Rohit Gandhi, ASU
Interconnects for Tomorrow’s Applications
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What happens when AI diagnoses patients better than doctors? Where does artificial intelligence truly stand on the hype cycle? Is all this computational power actually benefiting society? These critical questions frame our fascinating discussion recorded live at IMAPS Device Packaging Conference in Phoenix, Arizona.
Join our expert panel featuring Hemanth Jagannathan (IBM Research), Mark Kuemerle (Marvell), and Kimon Michaels (PDF Solutions) as they tackle AI's most pressing challenges and opportunities. Their collective expertise reveals surprising insights about how AI is transforming industries while raising important considerations about its implementation.
The conversation explores AI's evolution from specialized technical applications in semiconductors to today's consumer-facing generative tools. Our experts draw fascinating parallels between AI and previous technological breakthroughs like laser technology, suggesting we've only scratched the surface of potential applications. They provide compelling examples from healthcare where AI systems demonstrate superior diagnostic capabilities by processing complex datasets beyond human capacity.
While acknowledging concerns around data accuracy, power consumption, and appropriate boundaries, the panel remains optimistic about AI's future. They emphasize that today's implementations represent merely the beginning of a transformative technology whose full impact remains largely unanticipated. Yet they also agree on applications where human judgment should remain primary – including, amusingly, matchmaking.
Dive into this thought-provoking conversation to understand why organizations must either leverage AI effectively or risk being outpaced by competitors who do. Subscribe to 3D IncItes Podcast for more cutting-edge discussions on technologies shaping our future.
Interconnects for Tomorrow’s Applications
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Explore the transformative world of microelectronics packaging with industry visionaries Amy Lujan, Tim Olson, and Jan Vardaman as they share their journey at the IMAPS Annual Device Packaging Conference (DPC). With the conference relocating to the vast Wild Horse Pass, expect an enriched experience with expanded technical tracks and exhibitor opportunities reflecting the rising interest in this field. Get ready to embrace the future of packaging with insights that redefine its significance in the semiconductor industry.
Uncover the critical challenges facing AI infrastructure in a thought-provoking panel discussion with experts from IBM Research, Intel, and leading OSATs. We'll tackle whether today's infrastructure can keep pace with AI's explosive growth, especially concerning energy-efficient chip designs and packaging solutions. Learn about groundbreaking advancements and the potential to alleviate data center power consumption concerns through innovative packaging techniques. Beyond the tech talk, we'll highlight the vibrant networking scene at the conference, featuring events like the Backyard Olympics and a charity golf tournament, ensuring a perfect blend of professional growth and community building. Join us for a chance to network, learn, and potentially reshape the future of microelectronics packaging.
Interconnects for Tomorrow’s Applications
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The episode explores the key insights from the recent SEMI ISS event, focusing on the semiconductor industry's journey toward a trillion-dollar market by 2030. It discusses the significant themes of uncertainty and the transformative impact of AI, while also addressing industry challenges and emerging trends.
Additionally, SEMI's Market Intelligence team dive into the revised 2024 equipment forecast and World Fab Forecast, discussing trends influenced by AI technology and geopolitical factors, especially those linked to China.
As we detail the upswing in equipment sales, driven by Chinese investments and AI progress, we also spotlight the trends shaping both front and back-end equipment markets. From the resurgence of advanced packaging to the anticipated rebound in test equipment, this episode provides a thorough look at the semiconductor industry's current state and its promising future, including insights into the world fab forecast and its implications for the automotive and power sectors.
Highlights:
• Overview of SEMI ISS and its significance in the semiconductor industry
• Highlights on this year's theme: Ready, Set Ramp! and its implications
• Insights on overcoming market uncertainties and challenges
• AI's transformative role in driving semiconductor innovation
• Discussion of upcoming semi events and their importance for networking
• Market intelligence updates on forecasts and growth opportunities
Contact Our Guests on LinkedIn:
- Joe Stockunas, President, SEMI Americas
- Christian Dieseldorf, Senior Analyst, SEMI MIT
- Inna Skvortsova, Market Analyst, SEMI MIT
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
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Unlock the secrets of semiconductor packaging materials with insights from industry experts Dariush Tari and Rose Guino of Henkel's Semiconductor Packaging Materials Division. This episode promises a deep dive into the processes behind developing materials that are both reliable and high-performing, crucial for the ever-evolving demands of AI, machine learning, and quantum technologies.
Dariush and Rose share their wealth of knowledge on material characterization, modeling, and application engineering, and discuss how Henkel maintains its pivotal role within the semiconductor ecosystem. From underfills to thermal interface materials, discover how comprehensive material offerings are shaping the future of high-performance computing.
Explore the fascinating advancements in material modeling for semiconductors, where physics-based simulations are transforming reliability testing and development cycles.
Gain a clearer understanding of capillary underfill materials and their vital role in enhancing solder joint reliability under thermal stress.
This episode delves into the collaboration between material developers and modeling experts, underscoring the importance of early customer engagement to tailor innovative solutions.
If you are interested in learning how cutting-edge materials are propelling the semiconductor industry forward, this conversation is a must-listen.
Contact the Speakers on LinkedIn
Dariush Tari, Henkel Semiconductor Packaging Materials
Rose Guino, Semiconductor Packaging Materials
Henke's advanced materials elevate semiconductor packaging to meet power, performance, area and cost
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This episode was recorded live at SEMICON Europa.
Michael Zahn from Koh Young talks to Françoise von Trapp about the growing significance of metrology in semiconductor manufacturing and the need for advanced measurement technologies. They discuss the transition from 2D to 3D measurements in semiconductor manufacturing. Zahn explains why non-destructive, optical 3D measurements offer precise height and position data with sub-micron resolution.
You'll learn how these measurements are crucial for early defect detection, improving efficiency, and reducing waste. You'll also gain an understanding about the importance of real-time, in-line measurements for quality assurance and process optimization.
Zahn also highlights Koh Young's AI integration for process control and the future potential of sub-micron resolution systems.
Contact Michael Zahn on LinkedIn
Koh Young paves the way for smart factory solutions with 3D measurement-based inspection solutions.
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This episode was recorded live at SEMICON Europa. It features interviews with four of the 20 under 30 Recognition Award recipients from Cadence, ERS Electronic, KLA, and Semilab. It also features updates from Comet Yxlon, Trymax Semiconductor, and DSV-IMS.
SEMI Europe's 20 Under 30 program recognizes future leaders in the microelectronics industry.
James McGrath from KLA discussed his role as a PE CBD Process Engineer and his unexpected entry into the semiconductor industry.
Augustin Detruit from ERS Electronics highlighted his growth from a master's thesis to Head of Production, overseeing a significant increase in production capacity.
Luca Sinkó from Semilab shared her journey from physics to R&D Team Leader and her recent promotion to Product Manager.
Charis Kalantzi from Cadence detailed her role in supporting digital design tools and her involvement in community volunteering.
All four talk about what brought them into the semiconductor industry, what made them stand out to the judges, and the honor of receiving such an award.
From Dionys van de Ven, we hear about the announced the launch of Comet Yxlon's new 3D X-ray system for fab-level yield improvement,
Peter Dijkstra from Trymax, discussed what is driving the company's growth and it's expansion into the U.S. market.
Spencer Wall talks about DSV's acquisition of Schenker, and shares the progress so far. Michael Murray talks about DSV-IMS foray into using AI and machine learning to improve supply chain efficiencies.
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In this episode, recorded live at SEMICON Europa in Munich, Françoise von Trapp continues her conversations with the keynote speakers on helping to build Europe’s technical sovereignty, and how implementing digital twins can help achieve this goal.
John Behnke, of Inficon, discussed the evolution of smart manufacturing in the semiconductor industry. He highlighted how smart software can increase factory productivity by 5-15% by making autonomous decisions based on digital twins. You’ll learn about Behnke’s vision for the Smart Control Room.
Catherine Le Lan, Synopsys, emphasized the need for collaboration between academia and industry to address the talent shortage, suggesting cross-disciplinary education and early branding of microelectronics.
Katharina Westrich, Siemens, explained how digital twins optimize factory planning, reduce emissions, and train workforce remotely, envisioning a future where virtual and real-world operations are seamlessly integrated.
SEMIA global association, SEMI represents the entire electronics manufacturing and design supply chain.
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This episode was recorded live at SEMICON Europa in Munich. This year's theme of this year’s conference is "Innovation and Collaboration: Powering Sustainable Exponential Growth". In other words, how the semiconductor industry can work together to sustainably reach the trillion dollar goal by 2030 without compromising its Net Zero goals. It's going to be tricky, for sure.
Frederic Godemel of Schneider Electric talks about what he calls the “energy trilemma” that is causing the energy supply challenges. These are security, affordability, and the impact on the planet. He explains how electricity generated from renewable sources will help address these issues and implores the industry to focus on growing responsibly so it can meet its goals.
The conversation continues with Comet CEO, Stephan Haferl, who discusses the importance of developing power-efficient semiconductors. He talks about the power advantages of 3D stacking and heterogeneous integration and explains how 3D X-ray technologies helps bring these technologies to market.
Lastly, you’ll hear from Bart Placklé of imec, who talked about next generation vehicle architectures enabled by sensing and chiplets. You’ll learn what’s driving the need for chiplets in today’s software-defined vehicles, and how chiplet architectures can take us to the next level of autonomous vehicles.
SEMIA global association, SEMI represents the entire electronics manufacturing and design supply chain.
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It's been quite an exciting year for the U.S. Chips for America as the funding starts rolling out. All year long, Françoise von Trapp has interviewed various government dignitaries about various elements of the CHIPS Act. This episode brings these episodes together in order of appearance, to give you a timeline of the year's progress.
First up is Dan Berger, National Advanced Packaging Manufacturing Program (NAPMP), who explains how CHIPS Acts monies are being used to address gaps like advanced packaging and substrate manufacturing, to help revitalize the US semiconductor industry. The focus is on developing domestic manufacturing teams for U.S. leadership in microelectronics, with global collaboration and security in mind. He discusses the importance of advanced packaging roadmaps aimed at scaling down feature sizes, eliminating interposers and integrating chiplets directly onto substrates.
Next, we hear from the Honoroable Laurie Locascio, Director of NIST, and Undersecretary of Commerce for Standards and Technology. She explains importance of public-private collaboration, addressing research gaps, strategic investments, and global collaboration to ensure the industry's success and address economic and national security concerns.
Lastly, Dev Palmer explains Chips Act's funding distribution and its impact on the semiconductor ecosystem. He emphasizes the importance of bridging research and industry and describes some of the programs key initiatives. Palmer highlights the need for collaboration across large and small businesses, academia, and nonprofits to achieve the Chips Act's ambitious goals, and shares the details of the recently announced Small Business Innovation Research (SBIR) program under the Biden Harris administration.
Contact the Panelists on LinkedIn
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On September 30, 2024, Onto Innovation held the grand opening of its Packaging Applications Center of Excellence - or as it's being called, PACE. Françoise von Trapp attended the grand opening to learn why the company has partnered with like-minded suppliers of the panel-level packaging ecosystem to accelerate the development of PLP technologies for both organic and glass substrates. These include 3D InCites Members: LPKF Laser & Electronics, Evatec, MKS-Atotech and Lam Research; as well as Resonac, Corning, and others.
This episode starts off with a conversation with Onto Innovation CEO, Mike Plisinski, who explains how PACE came to be, its business model, and why AI is driving growth in panel-level packaging.
The story continues with a tour of PACE conducted by Keith Best, Director of PACE. Best gives a step-by-step description of the processes as panels move from the photoresist coater, to the lithography stepper, to the developer, and then to the inspection system. He also talks about the role advanced lithography tools play in developing down-stream panel level processes.
Lastly, you'll hear from PACE collaboration partners:
- Ralph Zoberbier, CMO, Evatec
- Kuldip Johal, MKS-Atotech
- Kazuyuki Mitsukura, Resonac
- Junro Yoon, Corning Advanced Optics
- Richard Noack, LPKF Laser & Electronics
Read the full story on 3D InCites
Onto InnovationYour partner for innovative solutions that improve time to market, yield, and product reliability.
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For this 3D InCites Podcast Extra, Françoise von Trapp traveled to Morrisville, North Carolina, to witness Foundry 2.0 in action at NHanced Semiconductors.
She speaks with founder and CEO Bob Patti about his vision for the company, which is based on implementing the Foundry 2.0 business model he conceptualized. It involves sourcing dies and chiplets from traditional foundries and applying semiconductor foundry processes and advanced packaging and assembly technologies.
You'll learn:
- What's driving the transition to advanced packaging from traditional scaling
- Why the traditional foundry model may not be the way going forward
- How Foundry 2.0 is different
Françoise also takes you on an audio tour of the facility, led by Operations Director, Carl Petteway. It gets a bit noisy - but you'll feel like you're right there, and you'll learn about the tools used to perform processes like chemical mechanical polishing (CMP), photolithography, hybrid bonding, and through silicon vias.
Contact Our Guests on LinkedIn:
- Bob Patti, CEO and Founder, NHanced Semiconductors
- Carl Petteway, Operations Director, NHanced Semiconductors
Learn More:
Read the story and see the photos from the tour on the 3D InCites Website.
The USA’s First Pure-Play Advanced Packaging Foundry - Where Innovation Meets Precision
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Recorded live at the IMAPS Symposium 2024 in Boston MA, where 3D InCites member companies presented their latest technologies and showcased their products. This episode features conversations with nine of our member companies.
Brendan Wells, Amkor Technology, Inc., explains the difference between laminate and strip-based substrates for advanced packaging and when to use each. He also discusses how chiplet integration is impacting the assembly processes.
Evan Griffith and Sze Pe Lim, Indium Corporation, talk about how changing advanced packaging requirements for AI chip sets are changing the game for materials development.
John Lannon, general manager of Micross AIT talks about progress with the company’s 300mm capacity expansion and what it means to win the William T. Ashman and John A. Wagnon Technical Achievement Award.
LPKF’s Richard Noack talks about the difference between glass interposers and glass core technology, and what’s driving development of these materials.
Sally Ann Henry, ACM Research, talks about the company’s decision to invest in equipment platforms to support panel level packaging.
Casey Krawiec, StratEdge Corporation, talks about what it means to receive the IMAPS Society Award for Corporate Sponsorship, and why he thinks it’s important to support these activities.
Habib Hichri, Ajinomoto Fine Techno, talks about his work with IMAPS Academy, and Ajinomoto’s new developments beyond ABF dielectric film to address advanced packaging substrate material needs.
Adeia’s Guilian Gao talks about what OSATS need to do to support die to wafer hybrid bonding processes.
Scott Sikorski, IBM, explains how the Northeast Corridor from New York up into Canada is becoming one of the U.S.’s hot spots in advanced packaging.
Peter Cronin, MRSI Micronic, introduces the company’s latest die bonders system, and talks about a new application center in Livermore
IMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.
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At IMAPS Symposium 2024, the annual IMAPS Society Awards were presented. These awards recognize IMAPS members who stand out for their efforts. They are peer-nominated awards and selected by a panel of previous winners, so it’s very special to receive one, as it means many members have noticed their efforts.
In this episode, Françoise sits down with three of the award winners to talk about their IMAPS experience, at different stages of their careers.
Emma P Pawliczak was awarded the Steve Adamson Student Award. She is currently getting her Ph.D. at Binghampton University.
Brandon Hamilton won the Emerging Leader Award, is a program manager at BAE Systems in Cedar Rapids Iowa
Dr. Phil Garrou won the Lifetime Achievement Award. He is an Advanced Packaging subject matter expert for DARPA and the DoD through his consulting company Microelectronic Consultants of NC (MCNC).
- You’ll learn about the history of IMAPS and its origins from Phil
- You’ll learn how Emma benefits from student opportunities at IMAPS
- You’ll learn about how IMAPS helped Brandon make connections in the industry
- All three talk about mentorship opportunities and how IMAPS provides a supportive community throughout a microelectronics career.
Contact the Speakers on LinkedIn:
- Dr. Phil Garrou, MCNC
- Emma Pawliczak, Binghamton University
- Brandon Hamilton, BAE Systems
IMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.
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This episode was recorded live at the IMAPS International Symposium in Boston MA. Françoise von Trapp speaks with Dev Palmer, director of the National Advanced Packaging Manufacturing Program; Sandeep Sane of Lightmatter; Craig Bishop, Deca and Brett Wilkerson, AMD.
Dev Palmer explains Chips Act's funding distribution and its impact on the semiconductor ecosystem. He emphasizes the importance of bridging research and industry and describes some of the programs key initiatives. Palmer highlights the need for collaboration across large and small businesses, academia, and nonprofits to achieve the Chips Act's ambitious goals, and shares the details of the recently announced Small Business Innovation Research (SBIR) program under the Biden Harris administration.
Sandeep Sane, Head of Packaging at LightMatter, discusses the role of 3D optical integration in extreme compute scaling. He highlights the challenges in integrating silicon photonics into chip designs to provide high bandwidth at lower power, essential for AI and data centers. You’ll learn how 3D stacking addresses memory and logic competition on chips; and how chiplet-based architectures improve performance but increase power consumption.
Craig Bishop of DECA and Brett Wilkerson of AMD discuss the evolution and applications of Redistribution Layer (RDL) packaging, particularly in high-performance computing and AI. They also highlightthe role of AI in enhancing packaging design and the future of AI applications, emphasizing the need for both centralized and edge computing to balance performance and power consumption.
Contact The Speakers on LInkedIn
Resources
- For General Inquiries about CHIPS for America askchips@chips.gov
- For CHIPS Incentives Program inquiries apply@chips.gov
- For Congressional inquiries about CHIPS for America legislativeaffairs@chips.gov
IMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.
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In this episode, Françoise von Trapp speaks with Chee Ping Lee, of Lam Research, about the critical role of high bandwidth memory (HBM) in generative AI, emphasizing its high bandwidth and compact design.
HBM memory has received a lot of attention as one of the first technologies to implement 2.5D and 3D stacking. Lee explains how HBM uses advanced packaging technologies like TSV and microbumps to achieve high memory capacity and performance. Lam Research's solutions are key to HBM's success.
Listen to learn details about:
- The importance of HBM for AI chip manufacturing
- The relationship between advancedpackaging and HBM
- The differences between different HBM generations
- The future of microbumps and hybrid bonding
- Lam Research’s advanced packaging solutions
Contact Chee Ping Lee on LinkedIN
Learn more about why HBM Is a critical enabler for generative AI in this blog post.
Lam ResearchLam Research equipment and services allow chipmakers to build smaller and better performing devices
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In this episode, Francoise von Trapp speaks with Isabella Drolz from Comet about how AI is revolutionizing semiconductor inspection strategies, particularly in 3D X-ray systems. They discuss how AI is being used to find structural defects in advanced chip packages, and also how 3D inspection is being used to develop advanced AI technologies themselves.
von Trapp and Drolz explore the evolution of inspection methods in advanced packaging, noting the complexity of 3D ICs and the limitations of traditional optical inspections. Drolz emphasizes the importance of AI in accelerating yield curves and improving inspection efficiency. She also mentions the need for an enterprise solution to integrate various inspection tools.
You’ll learn:
- About the difference between 2D and 3D X-ray technologies
- How 3D X-ray evolved over the past decade so that it can be used effectively in volume production
- How Comet Yxlon’s CA 20 tool, integrated with the AI software Dragonfly, enhances defect detection by using deep learning to analyze X-ray images
Contact Isabella Drolz on LinkedIn
Comet XylonComet Yxlon delivers high-end X-ray and CT system solutions for advanced packaging inspecton needs.
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In this episode, Francoise speaks with Simon McElrea, an interconnectologist, about his career in and the evolution of interconnectology, emphasizing its importance in semiconductor packaging.
McElrea discusses his roles at semiconductor start-ups like Vertical Circuits and Invensas; his foray into wireless charging at Energous and FreePower; and his return to the semiconductor industry due to its current inflection point.
He talks about how the Chips Act favors large companies over startups and stressed the need for government support to attract young talent and foster innovation. Lastly, McElrea explained how to better support startups and disruptive technologies in the semiconductor industry through policies and funding.
Listen and learn:
· How adopting the term "interconnectology" will change the narrative around advanced packaging
· Why we need to inspire young talent to pursue careers in interconnect-focused fields like packaging through initiatives at universities
· The role of consortia and joint ventures can play
Contact Simon McElrea on LinkedIn
LQDXLQDX is setting a new metal deposition standard with its breakthrough family of Liquid Metal Inks®.
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In this episode, Françoise von Trapp talks with Onto Innovation’s Monita Pau and Jiangtao Hu about metrology for advanced packaging – why do we need it? What are the challenges, and how do we solve them?
In semiconductor manufacturing front-end processes, metrology has always been a critical step to ensure consistency of very fine features. It’s only recently become important to back-end advanced packaging processes – especially for heterogeneous integration. As chips are designed with smaller features, advanced packaging processes are becoming more front-end like.
You’ll learn about how metrology designed for front-end manufacturing is being reimagined for wafer-level and assembly applications such as:
- Hybrid bonding
- 3D stacking with micro bumps
- RDL applications for interposers
- TSV applications
The speakers discuss the challenges, gaps, and solutions for each. You’ll also learn what makes Onto Innovation uniquely qualified to support this.
Contact Our Guests on LinkedIn
Onto InnovationYour partner for innovative solutions that improve time to market, yield, and product reliability.
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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
In this episode, Tarak Railkar and Benson Chan join Françoise von Trapp for a preview of The IMAPS International Symposium 2024, which takes place in Boston from September 30 to October 3, 2024.
This year's symposium focuses on heterogeneous integration for paradigm-shifting microelectronics and photonics. It will feature a five-track technical program, special interactive sessions on onshoring, keynote speakers by industry leaders, and much more. The symposium will also host a Bingo networking event to promote DEI, a career fair, student poster sessions, and off-site tours to MIT and MRSI Systems.
Listen in to learn about:
- The benefits of volunteering for IMAPS
- Networking and career opportunities
- The speaker and panel line-up
Register for this year's IMAPS Symposium here.
Contact the Speakers on LinkedIn
IMAPS InternationalIMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.
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Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
In this episode, Françoise von Trapp speaks with Bruce Kim, of SurplusGLOBAL, for an update on the semiconductor secondary equipment market, and how the US. and European Chips Acts are impacting it.
They also discuss the trend of top-tier OEMS prioritizing the development of innovative technology rather than investing in legacy tools that are still very much in need, and the impact this is having on device manufacturers that rely on legacy tools, but have trouble finding repair parts. This was part of an interview with Bruce by WorldFolio. Find the complete article here.
You’ll learn how SurplusGLOBAL is building a global parts platform that helps legacy tool owners find parts, and also manufactures replacement parts for those that have become obsolete. You’ll also learn how AI is helping to optimize this business. You’ll also hear about the 2030 Big Cluster Project, the company’s global expansion in semiconductor manufacturing hot spots around the globe, and more.
Contact Bruce Kim on LinkedIn
SurplusGLOBALSurplusGLOBAL is one of the largest one-stop platforms for pre-owned semiconductor equipment.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
In this episode, Françoise von Trapp and underfill materials expert, Dick Jensen, NAMICS corporation explore the societal and technological challenges that impact microelectronic materials development.
The conversation focuses on the evolution of underfill materials development over the past 30 years. They discuss the importance of underfill materials in semiconductor manufacturing, focusing on their compatibility, environmental impact, and properties.
You’ll learn about:
- The development of specialized underfill materials for advanced packaging technologies, including AI chips, and the challenges arising from material changes in electronics manufacturing
- Historical examples of working with restricted substances and how that created a need for alternative materials
- The current need for collaboration and innovation to address the issue of PFAS chemicals in products
- Why and how much testing is important to ensure material compatibility and performance
NAMICS Corporation provides advanced materials and solutions for the semiconductor industry.
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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
This episode was recorded live at SEMICON West 2024 – SEMI’s flagship tradeshow where the global industry gathers to showcase its latest products and technologies; and discuss topics critical to the industry’s growth. Two of these continue to be Sustainability and Workforce Development. Today’s guests will address both these topics.
Paul Kelly, Vice President of Strategies, Partnerships, & New Ventures and Chief Operating Officer of NY CREATES, and Dr. Mousumi Bhat, SEMI Vice President of Sustainability Programs join Françoise von Trapp to discuss an environmental sustainability partnership between NY CREATES and the SEMI Climate Consortium (SCC). You'll learn:
- What the SCC is all about and why it's a crucial step forward for the semiconductor industry
- New York's leadership role in addressing environmental sustainability for the semiconductor industry
- What the agreement between SEMI and NY CREATES covers
- How the climate agreement dovetails with the CHIPS Act and it's goals
- and more.
Our second guest is Shari Liss, Director of SEMI Foundation. She updates Françoise on the initiatives her team launched in the U.S. to address the semiconductor talent shortage, and how they are being rolled out in other parts of the globe.
Connect with our guests on LinkedIn:
- Paul Kelly, NY CREATES
- Mousumi Bhat, SEMI
- Shari Liss, SEMI Foundation
SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
The semiconductor industry supply chain continues to capture attention as general awareness about the importance of semiconductors in our everyday lives grows.
The news of global expansion and ongoing delays of new fabs coming online is constant. But have you ever stopped to think how complicated it is to outfit a fab with its highly calibrated, sensitive equipment? There are many moving parts to consider – both figuratively and literally.
In this episode, Françoise von Trapp leads a conversation with Barry O’Dowd of Kuehne+Nagel; Kevin Mille, of KLA, and Emerald Grieg, of PTW Group to discuss what it takes to successfully move a piece of semiconductor equipment from the supplier to the manufacturer.
The speakers discuss trade compliance and logistics challenges, the proper approach to packing and crating sensitive equipment, and how to ensure safe transportation. They discuss the differences between moving new equipment from an OEM, and secondary equipment from a broker. They also share stories of when things didn’t go exactly to plan, and what they learned from the experience.
Listen in and learn:
- What you should consider when you’re ready to move a tool
- What you need to know about trade compliance issues
- What to do if the customer is not ready to receive the tool
- The importance of communication and collaboration throughout the process
- The importance of using specialists who understand the complexities of semiconductor equipment and parts
- And more…
Contact Our Panel on LinkedIn:
Kuehne+NagelTrust Semicon Logistics by Kuehne+Nagel to navigate even the most demanding supply chain challenges.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
This week’s episode was recorded live at SEMICON West where 10 of our community members have news to share. The conversation focused on the latest advancements in semiconductor technology, including lithography, packaging, and materials. Speakers discussed the need to reduce power consumption in AI chips, the potential of using interposers to connect dies without pads, and the ongoing talent crisis in the industry. They also highlighted the importance of sustainability and the potential for the industry to reach a trillion-dollar goal by 2030. Additionally, speakers discussed the expansion of companies in North America, the significance of UV laser debonding, and the investment in electric vehicles and carbon initiatives.
Speakers include:
- Ken McWilliams, of Multibeam Corporation, and Brad Ferguson of Skywater Technology
- Ram Trichur, Henkel Technologies
- Alan Weber, PDF Solutions
- Nirmalya Maity and Zia Karim, Yield Engineering Systems (YES)
- Martin Elzingre and Jeremy Sanner of Edwards
- Dave Kirsch and Thomas Uhrmann of EV Group
- Spencer Wall and Robert Green of DSV–IMS
- Chuck Byers, of Monozukuri (MZ Technologies)
- Meg Conkling, of Veeco
- Bernd Krafthofer of ERS Electronic GmbH
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
From IMAPS DPC 2025: How Arizona's Universities and Schools Are Revolutionizing Semiconductor Education
42:59
From IMAPS DPC 2025: How Artificial Intelligence is Transforming Industries and Society
23:51
What's In Store for IMAPS DPC 2025: Featuring Amy Lujan, Tim Olson, and Jan Vardaman
26:43
SEMI ISS 2025 Recap and Semiconductor Market Update
37:32
The Role of Material Modeling in Semiconductor Packaging Innovation
32:56
Koh Young's Michael Zahn Talks About Putting 3D Measurement Technology to Work for Semiconductor Manufacturing
18:55
SEMICON Europa 3D InCites Member Spotlight: 20 Under 30 Recipients and More
46:10
SEMICON Europa 2024: Can Digital Twins Help Solve Europe's Talent Gap and Build Technical Sovereignty?
44:45
SEMICON Europa 2024: How Do We Power Sustainable Exponential Growth?
42:30
The U.S. CHIPS for America Mash-Up
42:52
Onto Innovation's PACE Partners Talk About Collaborating on Panel-Level Packaging
1:04:58
Witnessing Foundry 2.0 In Action with NHanced Semiconductor's Bob Patti and Carl Petteway
53:29
LIVE from Boston MA: Member Highlights from IMAPS Symposium 2024
1:24:06
IMAPS Society Award Winners Talk About How Belonging to IMAPS Enriched Their Microelectronics Careers
20:30
Live from IMAPS Symposium 2024: Updates on the NAPMP, Silicon Photonics and RDL Packaging
47:46
Lam Research’s Chee Ping Lee Explains the Role of HBM in Generative AI
39:11
Comet's Isabella Drolz Explains How 3D X-Ray Uses AI to Help Build AI Chips
20:52
So You Want To Be an Interconnectologist? A Conversation with Simon McElrea of LQDX
34:43
Monita Pau and Jiangtao Hu Talk About Addressing The Challenges of Metrology for Advanced Packaging
29:58
Tarak Railkar and Benson Chan Preview IMAPS Symposium 2024
23:40
Bruce Kim of SurplusGLOBAL: The Impact of the CHIPS Act on the Secondary Equipment Market
24:31
30 Years of Underfill Technology: How Societal and Technological Challenges Impact Materials Development
26:08
SEMICON West 2024: Updates on The SEMI Climate Consortium and Workforce Development
33:18
Navigating The Touchpoints of the Semiconductor Equipment Journey
43:01
3D InCites Members Share Perspectives from SEMICON West 2024
1:45:02