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The race toward more powerful AI carries a hidden cost that's becoming impossible to ignore: skyrocketing energy consumption. Did you know AI is projected to devour 10% of global electricity by 2030? This staggering figure has even forced tech giants to delay their sustainability goals.

Enter ASE's Executive Vice President Yin Chang, who reveals how the world's largest semiconductor packaging company is tackling this challenge head-on. The solution lies in revolutionary approaches to power delivery and data transmission. By integrating voltage regulators directly into substrates, power can be delivered mere nanometers from compute chips, drastically reducing energy loss. Even more promising is the shift from electrons to photons for data transmission, which slashes power consumption by an impressive 6x.

At the heart of these innovations is ASE's VI-PACK platform, a comprehensive toolbox that empowers system architects to create maximally efficient AI systems. Moving compute components closer together minimizes power requirements, while co-packaged optics enable the crucial electron-to-photon conversion for longer-distance communication. These technologies aren't just theoretical—industry leaders like NVIDIA and AMD are already implementing them, with significant efficiency improvements expected within five years.

The conversation extends beyond data centers to the future of AI at the edge. As foundry processes advance toward smaller nodes, the voltage requirements decrease, making AI more viable for battery-powered devices. Chang envisions a near future where personal devices run limited AI models locally, offering enhanced privacy by processing sensitive data without cloud dependencies.

Discover how advanced packaging is becoming the unsung hero in balancing our appetite for AI innovation with the planet's energy limitations. Follow ASE Global on LinkedIn or visit aseglobal.com to learn more about their pioneering work in sustainable semiconductor solutions.

Learn more at aseglobal.com or follow ASE Global on LinkedIn.

ASE
ASE plays a significant role in the development of the world’s most innovative electronics.

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The 75th anniversary celebration of ECTC in Dallas showcases a remarkable evolution in advanced packaging technologies, revealing how semiconductor priorities have dramatically shifted. Rather than the relentless miniaturization of the smartphone era, today's AI-driven applications demand larger packages with more functionality and sophisticated thermal management solutions.

Glass core substrates emerged as the star technology of the conference, with standing-room-only sessions demonstrating the industry's intense interest in this promising material platform. The excitement is justified – glass offers superior dimensional stability and enables higher-density interconnects than traditional organic substrates. Meanwhile, co-packaged optics generated similar enthusiasm as engineers tackle the monumental challenge of powering AI server racks that consume between 0.5-1 megawatt each, making energy efficiency a critical concern.

Through conversations with industry leaders including Monita Pau (Onto Innovation), Charles Lee and Mark Gerber (ASE), Tim Olson (Deca),  Scott Sikorski (IBM), Roland Rettenmeier, (SCHMID Group), Simon McElrea (LDQX), Henan Zhang, (ACM Research), and Evelyn Weng (ERS Electronic) we gain insights into how these technologies will reshape semiconductor packaging.

With record attendance exceeding 2,500 participants, ECTC has firmly established itself as the premier venue for pre-competitive research in advanced packaging. The technologies showcased this year may take 5-10 years to reach high-volume manufacturing, but they provide a crucial window into the semiconductor industry's future direction. As one participant aptly noted, "We used to draw pictures of these advanced packaging technologies and people quite often laughed... now they are actually production products because it was the only way to get there."

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What happens when the world's thirst for artificial intelligence collides with physical limitations? The answer lies at the intersection of silicon innovation and packaging technology.

From the conference hall of ECTC 2025 in Dallas, we're joined by Sam Naffziger of AMD who reveals how AI has transformed from a peripheral topic to the dominant force in computing within just five years. The economic motivation is clear: creating machines that generate intelligence offers "uncalculable value" to humanity. Yet as Nafziger explains, today's large language models face significant limitations—they excel at pattern recognition but struggle with true reasoning, suffer from hallucinations, and require human verification for mission-critical applications.

Perhaps most surprising is Nafziger's revelation about "the data wall"—general-purpose AI models have essentially exhausted the high-quality training data available on the internet. This constraint is pushing AI development toward more sophisticated approaches involving reinforcement learning and models that check other models, gradually shifting from simple pattern recognition toward deliberative thinking that more closely resembles human reasoning.

The conversation tackles the looming concern of AI's energy consumption, projected to reach 10% of global power by 2030. Rather than viewing this as an insurmountable problem, Nafziger offers a compelling perspective: AI's ability to optimize countless processes—from transportation routing to crop yields and manufacturing efficiency—could ultimately lead to net energy savings despite its own substantial power requirements.

For the advanced packaging community, the message is clear: your work sits at the foundation of AI's future. As computational demands increase exponentially, innovations in thermal management, power delivery, and component integration will directly determine how quickly and effectively AI can evolve. 

Connect with Sam Naffziger on LinkedIn or visit AMD.com to learn more about their competitive AI solutions and join the conversation about technology that's reshaping our world.

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What happens when you gather 75 years of packaging innovation under one roof? The Electronic Component Technology Conference (ECTC) has transformed from a modest gathering of 300 electronics professionals to a powerhouse event attracting over 2,500 industry leaders, researchers, and visionaries. This remarkable journey reflects how advanced packaging has evolved from supporting technology to the driving force behind modern electronics.

In this special episode, we speak with three generations of ECTC committee members: Pat Thompson (with 41 years of ECTC experience), Przemek Gromala (10 years), and Florian Herault (since 2010). They share fascinating insights into how the conference has tracked—and often predicted—the industry's most significant shifts. From the days when Ball Grid Arrays were cutting-edge to today's excitement around hybrid bonding and chiplets, ECTC has been the barometer for packaging innovation.

The conversation reveals how technologies that once caused standing-room-only excitement have either become industry standards or faded into obscurity. Remember 450mm wafers? That path was abandoned in favor of panel-level packaging. Through-silicon vias struggled with cost issues for years before finding their sweet spot in high-performance applications. And the longstanding debate between System-on-Chip and System-in-Package approaches has evolved into today's heterogeneous integration paradigm.

Looking forward, our guests highlight the challenges driving tomorrow's innovations: thermal management for power-hungry AI chips, specialized edge computing architectures, and adapting advanced electronics to automotive and other harsh environments. As Host Françoise von Trapp observes, "It's a great time to be a nerd," with abundant technical challenges ensuring exciting work for packaging professionals for decades to come.

Don't miss our upcoming episode featuring ECTC keynote speaker Sam Naffziger discussing responsible AI implementation and the critical role of packaging in creating energy-efficient high-performance devices!

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Pratyush Kamal explains how 3DIC technologies are transforming semiconductor design as Moore's Law slows, requiring closer integration between chip and package design to maximize performance.

• Traditional chip design treated packaging as an afterthought with designers "throwing designs over the wall"
• Economic realities of advanced nodes mean companies now pay more for smaller transistors, driving chiplet adoption
• Thermal challenges multiply in 3D stacks as power density doubles with each added layer
• Data centers projected to consume 10% of US electricity by 2030, making power efficiency critical
• Siemens working to standardize design languages across tools and enable open chiplet ecosystems
• Average age of electrical engineers in US is 57, creating urgent need for workforce development
• Universal Chiplet Interconnect Express (UCIe) emerging as key standard for chiplet interoperability

Visit siemens.com/3DIC to learn more about Siemens' comprehensive 3DIC solutions.

Siemens EDA
Siemens' EDA software helps you turn today's ideas into the sustainable products of the future.

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Andrew Mathers, Principal Product Line Manager at Nordson Test and Inspection, discusses the revolutionary advancements in 3D x-ray inspection technology and how they're improving semiconductor manufacturing quality.

• X-ray inspection requires high resolution, speed, and cost-effectiveness to drive better product quality
• Traditional 2D radiographic imaging is being replaced by 3D imaging for more stringent manufacturing requirements
• Planar CT imaging suffers from artifacts when inspecting flat electronic components like circuit boards and wafers
• Dynamic Planar CT takes more images from different angles with a wider field of view, reducing artifacts
• New technology operates twice as fast as traditional methods while reducing x-ray dose to sensitive components
• Automated inspection systems integrate directly into manufacturing lines with no human interaction required
• Common applications include detecting voids in ball grid arrays and micro bumps in flip chip devices
• The technology supports Quality 4.0 initiatives by providing feedback to improve manufacturing processes
• Nordson's systems are in use worldwide with an install base exceeding 2000 automated x-ray inspection systems

Learn more about Dynamic Planar CT and Nordson's x-ray inspection solutions at nordson.com or on their YouTube channel.

Nordson Test and Inspection
Delivering best-in-class test, inspection, and metrology solutions for semiconductor applications.

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The IEEE MTTS International Microwave Symposium attracts over 9,000 attendees and 500+ exhibitors to share cutting-edge developments in RF, microwave, and advanced packaging technologies. Tim Hancock and Jim Buckwalter from the IMS committee explain why this premier event, taking place in San Francisco's Moscone Center from June 15-20, has become increasingly relevant to professionals in advanced packaging and heterogeneous integration.

• Approximately 15% of accepted papers directly address packaging and heterogeneous integration topics
• Papers undergo rigorous double-blind review with an in-person committee meeting to ensure highest quality content
• Technical focus includes laminate technology, chip stacking, thermal management, and other critical packaging technologies
• Special workshops address 3D heterogeneous integration, millimeter-wave phased arrays, and advanced packaging solutions
• Exhibition floor features 500+ companies providing networking opportunities and technology discovery
• Student programs include design competitions, volunteer opportunities, and dedicated sessions for underrepresented groups
• Early bird registration ends May 16th with regular registration continuing at ims-ieee.org

Register at ims-ieee.org to secure your spot and book accommodations before they fill up.

THE 2025 IEEE MTT-S IMS
The 2025 IEEE MTT-S IMS is the largest event for RF and microwave professionals in the world.

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Acoustic inspection stands as a silent sentinel in semiconductor manufacturing, detecting microscopic defects that could lead to catastrophic failures in high-value applications. Bryan Schackmuth, Senior Product Line Manager at Nordson Test and Inspection, reveals how this technology has evolved from laboratory tools to production-line essentials.

When ultrasound encounters even the tiniest air gap—we're talking hundreds of angstroms—it reflects completely, making acoustic imaging uniquely powerful for evaluating bonds between materials. While optical inspection shows surface defects and X-ray reveals density variations, acoustic inspection peers between layers, identifying delamination and other hidden flaws that might otherwise escape detection until field failure.

The challenges of advanced packaging have driven significant innovation in acoustic inspection technology. As manufacturers stack more die, create complex interconnects, and push toward heterogeneous integration, the value of each wafer increases dramatically. Nordson's SpinSam system represents a breakthrough in this space, replacing traditional raster scanning with a rotational approach that achieves 41 wafers per hour—eight times faster than previous generation technology—while maintaining resolution down to 10 microns.

Beyond pure speed, the system's spinning scan technology offers unique advantages for edge inspection where defects are more common due to coefficient of thermal expansion effects. The modular design allows maintenance on individual scanners while others continue operating, maximizing uptime in production environments. Most exciting is the integration of AI and machine learning for defect detection, moving beyond simple thresholds to analyze complex multilayer images simultaneously.

Want to see how your inspection strategies might benefit from these advances? Check out Nordson's SpinSam technology at nordson.com and discover how acoustic inspection is helping manufacturers achieve higher yields and more reliable products in today's most demanding semiconductor applications.

Nordson Test and Inspection
Delivering best-in-class test, inspection, and metrology solutions for semiconductor applications.

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The 3D InCites Podcast celebrates microelectronics industry innovation with a special episode featuring this year's award winners in heterogeneous integration and chiplet technology.

• SallyAnn Henry, Jim Straus and David Wang, ACM Research, describe a horizontal rotation plating system for panel-level packaging with superior uniformity across square substrates
• Eric Gongora, of MacDermid Alpha, explains how NovaFab fine-grained copper enables hybrid bonding with customizable annealing times and improved electron migration resistance
• Chuck Woychik, NHanced Semiconductors, talks about how the company brings hybrid bonding capabilities onshore with expertise in

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EV Group
EV Groups supplies high-volume equipment and process solutions for semiconductor manufacturing.

KLA, SPTS Division
KLA provides semiconductor equipment for metrology, inspection, wafer processing, and more.

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Navigating today's complex manufacturing landscape demands unprecedented supply chain resilience. This eye-opening conversation with Barry O'Dowd (Kuehne+Nagel) and Kamal Ahluwalia (Resilinc) reveals why robust supply chains matter more than ever—particularly for semiconductor capital equipment.

The semiconductor industry operates at extraordinary precision, with equipment working at scales as small as five nanometers—roughly 1/18,000th the width of a human hair. This precision makes these multi-million dollar tools exceptionally vulnerable during transport, requiring meticulous handling across tens of thousands of miles between manufacturing and installation. With leading-edge fabs costing up to $20 billion, equipment failures or delays can trigger catastrophic financial consequences.

Our experts explain how companies are reimagining resilience through sophisticated data analysis, multi-tier visibility, and proactive risk management. Barry shares how Kuehne+Nagel's risk mitigator tool brings together all supply chain stakeholders to identify vulnerabilities and implement mitigation strategies—expertise developed during their flawless delivery of over 2 billion COVID vaccines. Meanwhile, Kamal describes how Resilinc helps organizations leverage AI to anticipate disruptions across 40 different risk categories, from natural disasters to financial instability.

The conversation offers practical advice for strengthening your own supply chain: understand your end-to-end process, engage with experienced partners, and adopt a first-principles approach to reimagining resilience with current technology. As global uncertainties continue mounting—from geopolitical tensions to extreme weather events—supply chain resilience isn't merely about risk avoidance; it's becoming a strategic competitive advantage.

Kuehne+Nagel
Trust Semicon Logistics by Kuehne+Nagel to navigate even the most demanding supply chain challenges.

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The 3D InCites Member Spotlight episode features exclusive conversations with industry leaders at IMAPS Device Packaging Conference 2025, exploring the cutting-edge of semiconductor packaging innovation and domestic manufacturing expansion.

• Rex Anderson of Micross details their RESHAPE program funding and Integra acquisition, establishing them as North America's largest domestic OSAT
• Calvin Cheung of ASE explains how advanced packaging enables AI infrastructure while reducing power consumption by 40-60% through vertical power delivery. He also describes silicon photonics emerging as a game-changer for data transmission, using light instead of electrons for faster, more energy-efficient signal integrity
• Keith Felton of Siemens discusses digital twin technology allowing early predictive analysis during package prototyping to prevent costly downstream engineer change orders - or ECOs.
• Vahid Akhavan highlights PulseForge's photonic debonding technology partnerships for clean, high-yield wafer release
• Bernd Krafthoefer and Florian Lechner, ERS Electonic representatives,  share insights on their new European competence center and sub-micron photonic debonding capabilities for 300mm wafers.

Join us next week as we explore supply chain resilience in the semiconductor capital equipment sector with Barry O'Dowd from Kuehne+Nagel and special guest Kamal Aluwalia, CEO of Resilinc. Learn more about member be

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IMAPS Device Packaging Conference
Interconnects for Tomorrow’s Applications

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Arizona is transforming into the "Silicon Oasis" of America through an unprecedented collaboration that's reshaping semiconductor education from high school through graduate studies. At the heart of this revolution is a groundbreaking partnership between the University of Arizona and Chandler Unified School District, launching the nation's first high school career and technical education program focused on semiconductor manufacturing.

Starting July 2025, forty students will begin a two-year journey learning on industry-grade equipment—not "glorified children's toys" but actual mechatronic systems, universal robots, and PCB printing technology. What makes this program revolutionary is its design for multiple pathways; graduates can either enter the workforce immediately as technicians or continue to higher education with college credits already earned.

Meanwhile, Arizona State University is building the advanced end of this educational pipeline through CHIPS Act-funded initiatives like the Southwest Advanced Prototyping Hub and the SHIELD project. Graduate courses in semiconductor packaging have exploded in popularity, growing from just 27 students to over 175 in two years. The university is getting creative with outreach too, developing a "Packaging on Wheels" mobile facility to bring semiconductor education to schools nationwide.

The strength of Arizona's approach lies in its extensive industry involvement. Fifteen major companies form the steering committee for the high school program, providing real-world problems and case studies. Students from diverse backgrounds—electrical, mechanical, materials science, and chemical engineering—all find pathways into this multidisciplinary field.

As one industry expert notes, students with hands-on, industry-specific training dem

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Interconnects for Tomorrow’s Applications

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What happens when AI diagnoses patients better than doctors? Where does artificial intelligence truly stand on the hype cycle? Is all this computational power actually benefiting society? These critical questions frame our fascinating discussion recorded live at IMAPS Device Packaging Conference in Phoenix, Arizona. 

Join our expert panel featuring Hemanth Jagannathan (IBM Research), Mark Kuemerle (Marvell), and Kimon Michaels (PDF Solutions) as they tackle AI's most pressing challenges and opportunities. Their collective expertise reveals surprising insights about how AI is transforming industries while raising important considerations about its implementation.

The conversation explores AI's evolution from specialized technical applications in semiconductors to today's consumer-facing generative tools. Our experts draw fascinating parallels between AI and previous technological breakthroughs like laser technology, suggesting we've only scratched the surface of potential applications. They provide compelling examples from healthcare where AI systems demonstrate superior diagnostic capabilities by processing complex datasets beyond human capacity.

While acknowledging concerns around data accuracy, power consumption, and appropriate boundaries, the panel remains optimistic about AI's future. They emphasize that today's implementations represent merely the beginning of a transformative technology whose full impact remains largely unanticipated. Yet they also agree on applications where human judgment should remain primary – including, amusingly, matchmaking.

Dive into this thought-provoking conversation to understand why organizations must either leverage AI effectively or risk being outpaced by competitors who do. Subscribe to 3D IncItes Podcast for more cutting-edge discussions on technologies shaping our future.

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Explore the transformative world of microelectronics packaging with industry visionaries Amy Lujan, Tim Olson, and Jan Vardaman as they share their journey at the IMAPS Annual Device Packaging Conference (DPC). With the conference relocating to the vast Wild Horse Pass, expect an enriched experience with expanded technical tracks and exhibitor opportunities reflecting the rising interest in this field. Get ready to embrace the future of packaging with insights that redefine its significance in the semiconductor industry.

Uncover the critical challenges facing AI infrastructure in a thought-provoking panel discussion with experts from IBM Research, Intel, and leading OSATs. We'll tackle whether today's infrastructure can keep pace with AI's explosive growth, especially concerning energy-efficient chip designs and packaging solutions. Learn about groundbreaking advancements and the potential to alleviate data center power consumption concerns through innovative packaging techniques. Beyond the tech talk, we'll highlight the vibrant networking scene at the conference, featuring events like the Backyard Olympics and a charity golf tournament, ensuring a perfect blend of professional growth and community building. Join us for a chance to network, learn, and potentially reshape the future of microelectronics packaging.

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IMAPS Device Packaging Conference
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The episode explores the key insights from the recent SEMI ISS event, focusing on the semiconductor industry's journey toward a trillion-dollar market by 2030. It discusses the significant themes of uncertainty and the transformative impact of AI, while also addressing industry challenges and emerging trends.

Additionally, SEMI's Market Intelligence team dive into the revised 2024 equipment forecast and World Fab Forecast, discussing trends influenced by AI technology and geopolitical factors, especially those linked to China. 

As we detail the upswing in equipment sales, driven by Chinese investments and AI progress, we also spotlight the trends shaping both front and back-end equipment markets. From the resurgence of advanced packaging to the anticipated rebound in test equipment, this episode provides a thorough look at the semiconductor industry's current state and its promising future, including insights into the world fab forecast and its implications for the automotive and power sectors.

Highlights:

• Overview of SEMI ISS and its significance in the semiconductor industry 
• Highlights on this year's theme: Ready, Set Ramp! and its implications 
• Insights on overcoming market uncertainties and challenges 
• AI's transformative role in driving semiconductor innovation 
• Discussion of upcoming semi events and their importance for networking 
• Market intelligence updates on forecasts and growth opportunities

Contact Our Guests on LinkedIn: 

• Joe Stockunas, President, SEMI Americas
• Christian Dieseldorf, Senior Analyst, SEMI MIT

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SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.

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Unlock the secrets of semiconductor packaging materials with insights from industry experts Dariush Tari and Rose Guino of Henkel's Semiconductor Packaging Materials Division. This episode promises a deep dive into the processes behind developing materials that are both reliable and high-performing, crucial for the ever-evolving demands of AI, machine learning, and quantum technologies.

Dariush and Rose share their wealth of knowledge on material characterization, modeling, and application engineering, and discuss how Henkel maintains its pivotal role within the semiconductor ecosystem. From underfills to thermal interface materials, discover how comprehensive material offerings are shaping the future of high-performance computing.

Explore the fascinating advancements in material modeling for semiconductors, where physics-based simulations are transforming reliability testing and development cycles.

Gain a clearer understanding of capillary underfill materials and their vital role in enhancing solder joint reliability under thermal stress.

This episode delves into the collaboration between material developers and modeling experts, underscoring the importance of early customer engagement to tailor innovative solutions.

If you are interested in learning how cutting-edge materials are propelling the semiconductor industry forward, this conversation is a must-listen.

Contact the Speakers on LinkedIn
Dariush Tari, Henkel Semiconductor Packaging Materials
Rose Guino, Semiconductor Packaging Materials 

Henkel Semiconductor Packaging Materials
Henke's advanced materials elevate semiconductor packaging to meet power, performance, area and cost

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This episode was recorded live at SEMICON Europa.

Michael Zahn from Koh Young talks to Françoise von Trapp about the growing significance of metrology in semiconductor manufacturing and the need for advanced measurement technologies.  They discuss the transition from 2D to 3D measurements in semiconductor manufacturing.  Zahn explains why  non-destructive, optical 3D measurements offer precise height and position data with sub-micron resolution.

You'll learn how these measurements are crucial for early defect detection, improving efficiency, and reducing waste. You'll also gain an understanding about the importance of real-time, in-line measurements for quality assurance and process optimization.

Zahn also highlights Koh Young's AI integration for process control and the future potential of sub-micron resolution systems.

Contact Michael Zahn on LinkedIn

Koh Young Europe
Koh Young paves the way for smart factory solutions with 3D measurement-based inspection solutions.

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This episode was recorded live at SEMICON Europa. It features interviews with four of the 20 under 30 Recognition Award recipients from Cadence, ERS Electronic, KLA, and Semilab.  It also features updates from Comet Yxlon, Trymax Semiconductor, and DSV-IMS.

SEMI Europe's 20 Under 30 program recognizes future leaders in the microelectronics industry.

James McGrath from KLA discussed his role as a PE CBD Process Engineer and his unexpected entry into the semiconductor industry.

Augustin Detruit from ERS Electronics highlighted his growth from a master's thesis to Head of Production, overseeing a significant increase in production capacity.

Luca Sinkó from Semilab shared her journey from physics to R&D Team Leader and her recent promotion to Product Manager.

Charis Kalantzi from Cadence detailed her role in supporting digital design tools and her involvement in community volunteering.

All four talk about what brought them into the semiconductor industry, what made them stand out to the judges, and the honor of receiving such an award.

From Dionys van de Ven, we hear about the announced the launch of Comet Yxlon's new 3D X-ray system for fab-level yield improvement,

Peter Dijkstra from Trymax, discussed what is driving the company's growth and it'

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In this episode, recorded live at SEMICON Europa in Munich, Françoise von Trapp continues her conversations with the keynote speakers on helping to build Europe’s technical sovereignty, and how implementing digital twins can help achieve this goal. 

John Behnke, of Inficon, discussed the evolution of smart manufacturing in the semiconductor industry. He highlighted how smart software can increase factory productivity by 5-15% by making autonomous decisions based on digital twins. You’ll learn about Behnke’s vision for the Smart Control Room. 

Catherine Le Lan, Synopsys, emphasized the need for collaboration between academia and industry to address the talent shortage, suggesting cross-disciplinary education and early branding of microelectronics. 

Katharina Westrich, Siemens, explained how digital twins optimize factory planning, reduce emissions, and train workforce remotely, envisioning a future where virtual and real-world operations are seamlessly integrated. 

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Digital Disruption with Geoff Nielson
Discover how technology is reshaping our lives and livelihoods.

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SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.

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This episode was recorded live at SEMICON Europa in Munich. This year's theme of this year’s conference is "Innovation and Collaboration: Powering Sustainable Exponential Growth". In other words, how the semiconductor industry can work together to sustainably reach the trillion dollar goal by 2030 without compromising its Net Zero goals. It's going to be tricky, for sure.

Frederic Godemel of Schneider Electric talks about what he calls the “energy trilemma” that is causing the energy supply challenges. These are security, affordability, and the impact on the planet. He explains how electricity generated from renewable sources will help address these issues and implores the industry to focus on growing responsibly so it can meet its goals. 

The conversation continues with Comet CEO, Stephan Haferl, who discusses the importance of developing power-efficient semiconductors. He talks about the power advantages of 3D stacking and heterogeneous integration and explains how 3D X-ray technologies helps bring these technologies to market. 

 Lastly, you’ll hear from Bart Placklé of imec, who talked about next generation vehicle architectures enabled by sensing and chiplets. You’ll learn what’s driving the need for chiplets in today’s software-defined vehicles, and how chiplet architectures can take us to the next level of autonomous vehicles.

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A global association, SEMI represents the entire electronics manufacturing and design supply chain.

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It's been quite an exciting year for the U.S. Chips for America as the funding starts rolling out. All year long, Françoise von Trapp has interviewed various government dignitaries about various elements of the CHIPS Act. This episode brings these episodes together in order of appearance, to give you a timeline of the year's progress. 

First up is Dan Berger,  National Advanced Packaging Manufacturing Program (NAPMP), who explains how CHIPS Acts monies are being used to address gaps like advanced packaging and substrate manufacturing, to help revitalize the US semiconductor industry. The focus is on developing domestic manufacturing teams for U.S. leadership in microelectronics, with global collaboration and security in mind. He discusses the importance of advanced packaging roadmaps aimed at scaling down feature sizes, eliminating interposers and integrating chiplets directly onto substrates.  

Next, we hear from the Honoroable Laurie Locascio, Director of NIST, and Undersecretary of Commerce for Standards and Technology. She explains importance of public-private collaboration, addressing research gaps, strategic investments, and global collaboration to ensure the industry's success and address economic and national security concerns.

Lastly, Dev Palmer explains Chips Act's funding distribution and its impact on the semiconductor ecosystem. He emphasizes the importance of bridging research and industry and describes some of the programs key initiatives. Palmer highlights the need for collaboration across large and small businesses, academia, and nonprofits to achieve the Chips Act's ambitious goals, and shares the details of the recently announced Small Business Innovation Research (SBIR) program under the Biden Harris administration.

 Contact the Panelists on LinkedIn

• Dan Berger, Associate Director, NAPMP
• Dr. Laurie Locascio, NIST
• Dev Palmer, NAPMP

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On September 30, 2024, Onto Innovation held the grand opening of its Packaging Applications Center of Excellence - or as it's being called, PACE. Françoise von Trapp attended the grand opening to learn why the company has partnered with like-minded suppliers of the panel-level packaging ecosystem to accelerate the development of PLP technologies for both organic and glass substrates. These include 3D InCites Members: LPKF Laser & Electronics, Evatec, MKS-Atotech and Lam Research; as well as Resonac, Corning, and others.

This episode starts off with a conversation with Onto Innovation CEO, Mike Plisinski, who explains how PACE came to be, its business model, and why AI is driving growth in panel-level packaging.

The story continues with a tour of PACE conducted by Keith Best, Director of PACE.  Best gives a step-by-step description of the processes as panels move from the photoresist coater, to the lithography

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Onto Innovation
Your partner for innovative solutions that improve time to market, yield, and product reliability.

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For this 3D InCites Podcast Extra, Françoise von Trapp traveled to Morrisville, North Carolina, to witness Foundry 2.0 in action at NHanced Semiconductors. 
She speaks with founder and CEO Bob Patti about his vision for the company, which is based on implementing the Foundry 2.0 business model he conceptualized.  It involves sourcing dies and chiplets from traditional foundries and applying semiconductor foundry processes and advanced packaging and assembly technologies. 

You'll learn:

• What's driving the transition to advanced packaging from traditional scaling
• Why the traditional foundry model may not be the way going forward
• How Foundry 2.0 is different 

Françoise also takes you on an audio tour of the facility, led by Operations Director, Carl Petteway. It gets a bit noisy - but you'll feel like you're right there, and you'll learn about the tools used to perform processes like chemical mechanical polishing (CMP), photolithography, hybrid bonding, and through silicon vias.

Contact Our Guests on LinkedIn:

• Bob Patti, CEO and Founder, NHanced Semiconductors
• Carl Petteway, Operations Director, NHanced Semiconductors

Learn More:
Read the story and see the photos from the tour on the 3D InCites Website.

NHanced Semiconductors
The USA’s First Pure-Play Advanced Packaging Foundry - Where Innovation Meets Precision

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Recorded live at the IMAPS Symposium 2024 in Boston MA, where 3D InCites member companies presented their latest technologies and showcased their products. This episode features conversations with nine of our member companies. 

Brendan Wells, Amkor Technology, Inc., explains the difference between laminate and strip-based substrates for advanced packaging and when to use each. He also discusses how chiplet integration is impacting the assembly processes. 

 Evan Griffith and Sze Pe Lim, Indium Corporation, talk about how changing advanced packaging requirements for AI chip sets are changing the game for materials development.  

John Lannon, general manager of Micross AIT talks about progress with the company’s 300mm capacity expansion and what it means to win the William T. Ashman and John A. Wagnon Technical Achievement Award.  

LPKF’s Richard Noack talks about the difference between glass interposers and glass core technology, and what’s driving development of these materials.

Sall

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Digital Disruption with Geoff Nielson
Discover how technology is reshaping our lives and livelihoods.

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Interviews with Tech Leaders and insights on the latest emerging technology trends.

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IMAPS International
IMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.

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At IMAPS Symposium 2024, the annual IMAPS Society Awards were presented. These awards recognize IMAPS members who stand out for their efforts. They are peer-nominated awards and selected by a panel of previous winners, so it’s very special to receive one, as it means many members have noticed their efforts. 

In this episode, Françoise sits down with three of the award winners to talk about their IMAPS experience, at different stages of their careers.

Emma P Pawliczak was awarded the Steve Adamson Student Award. She is currently getting her Ph.D. at Binghampton University. 

Brandon Hamilton won the Emerging Leader Award, is a program manager at BAE Systems in Cedar Rapids Iowa

Dr. Phil Garrou won the Lifetime Achievement Award. He is an Advanced Packaging subject matter expert for DARPA and the DoD through his consulting company Microelectronic Consultants of NC (MCNC).  

• You’ll learn about the history of IMAPS and its origins from Phil
• You’ll learn how Emma benefits from student opportunities at IMAPS
• You’ll learn about how IMAPS helped Brandon make connections in the industry
• All three talk about mentorship opportunities and how IMAPS provides a supportive community throughout a microelectronics career. 

Contact the Speakers on LinkedIn:

• Dr. Phil Garrou, MCNC
• Emma Pawliczak, Binghamton University 
• Brandon Hamilton, BAE Systems

IMAPS International
IMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.

Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.

Support the show

Become a sustaining member!

Like what you hear? Follow us on LinkedIn and Twitter

Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.