3D InCites Podcast

A Conversation with Beth Keser About Writing A Book on Advanced Fanout Wafer Level Packaging

November 10, 2022 Francoise von Trapp/Beth Keser Season 2 Episode 37
3D InCites Podcast
A Conversation with Beth Keser About Writing A Book on Advanced Fanout Wafer Level Packaging
Show Notes

In this episode, Françoise speaks with Beth Keser, Ph.D., about her latest book co-authored with Steffen Kröhnert, ESPAT Consulting. 

Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces was published in December 2021. It is essentially a companion to the wafer-level packaging handbook titled, Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies, which the duo published in 2019. This book picks up where the first one left off, with 11 new chapters including contributions from some of the same companies that participated before, as well as new ones. 

 The book examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges, and is filled with contributions from some of the field’s leading experts.

In the interview, Beth talks about the book’s backstory, why and how it was written, and who participated. She also explains why they decided to begin the book with a market report, and how the book is a snapshot in time. 

Contact Beth Keser on LinkedIn

Order your own copy of Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces.

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