3D InCites Podcast

From IMAPS DPC 2023: Keynote Speakers Explore the EU Chips Act, Automotive Electronics, and Photonics Packaging

April 06, 2023 Francoise von Trapp/Silvie Joly/Basam Ziadah/Nicholas Harris Season 3 Episode 7
From IMAPS DPC 2023: Keynote Speakers Explore the EU Chips Act, Automotive Electronics, and Photonics Packaging
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3D InCites Podcast
From IMAPS DPC 2023: Keynote Speakers Explore the EU Chips Act, Automotive Electronics, and Photonics Packaging
Apr 06, 2023 Season 3 Episode 7
Francoise von Trapp/Silvie Joly/Basam Ziadah/Nicholas Harris

Send us a Text Message.

This episode features interviews that were recorded live at IMAPS DPC 2023.  

 First is an interview with CEA Leti’s Silvie Joly, who gave an industry coalition talk during the Global Business Council session, New Momentum in Semiconductors: Impact of Ecosystems, a European Case Study. Joly is the partnerships manager for 3D integration and packaging at CEA Leti. She provides key takeaways from her talk.

Next up is Basam Ziadah, who presented his keynote, Driving Adoption of Advanced IC Packaging in Automotive Applications. He talks about what drives more semiconductor devices in automotive applications. He describes the challenges we need to address to deliver advanced technology with the level of reliability required by the automotive industry, and how chiplet integration can be used. 

 Lastly, Françoise interviews Nicholas Harris, CEO of Lightmatter, who presented on extending Moore’s Law with photonics packaging. He explains why chiplets aren’t the panacea everyone thinks, of and how 3D integration using photonics packaging is the way forward to achieve performance at low power for artificial intelligence and high-performance computing.

Episode Guests

·      Sylvie Joly, CEA-Leti

·      Basam Ziadeh, General Motors

·      Nicholas Harris, Lightmatter

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IMAPS Device Packaging Conference
Interconnects for Tomorrow’s Applications

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Show Notes Chapter Markers

Send us a Text Message.

This episode features interviews that were recorded live at IMAPS DPC 2023.  

 First is an interview with CEA Leti’s Silvie Joly, who gave an industry coalition talk during the Global Business Council session, New Momentum in Semiconductors: Impact of Ecosystems, a European Case Study. Joly is the partnerships manager for 3D integration and packaging at CEA Leti. She provides key takeaways from her talk.

Next up is Basam Ziadah, who presented his keynote, Driving Adoption of Advanced IC Packaging in Automotive Applications. He talks about what drives more semiconductor devices in automotive applications. He describes the challenges we need to address to deliver advanced technology with the level of reliability required by the automotive industry, and how chiplet integration can be used. 

 Lastly, Françoise interviews Nicholas Harris, CEO of Lightmatter, who presented on extending Moore’s Law with photonics packaging. He explains why chiplets aren’t the panacea everyone thinks, of and how 3D integration using photonics packaging is the way forward to achieve performance at low power for artificial intelligence and high-performance computing.

Episode Guests

·      Sylvie Joly, CEA-Leti

·      Basam Ziadeh, General Motors

·      Nicholas Harris, Lightmatter

How to Start a Podcast Guide: The Complete Guide
Learn how to plan, record, and launch your podcast with this illustrated guide.
What If? So What?
We discover what’s possible with digital and make it real in your business

Listen on: Apple Podcasts   Spotify

IMAPS Device Packaging Conference
Interconnects for Tomorrow’s Applications

Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.

Support the Show.

Become a sustaining member!

Like what you hear? Follow us on LinkedIn and Twitter

Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Sylvie Joly, CEA Leti
Bassam Ziadah, General Motors
(Cont.) Bassam Ziadah, General Motors
Nicholas Harris, Lightmatter
(Cont.) Nicholas Harris, Lightmatter