3D InCites Podcast
Scott Hayes and Amy Lujan Talk About The History of IMAPS DPC and The Line-up for 2024
The International Microelectronics and Packaging Society’s Device Packaging Conference (IMAPS DPC) celebrates its 20th year this year. The conference takes place March 19-21, in Fountain Hills, AZ.
In this episode, Françoise von Trapp speaks with Scott Hayes, General Chair, IMAPS DPC, and Amy Lujan, General Chair-Elect of IMAPS DPC about the history of this event, and what sets it apart from IMAPS annual Symposium.
This year’s event will focus on heterogeneous integration and growth drivers for packaging, with speakers from companies like AMD, Intel, Facebook Reality Labs, and more. The General Business Council session will focus on Chips for America funding, doing business in China, and the significant growth of the U.S. semiconductor supply chain, particularly in Phoenix, AZ.
You’ll learn about the key applications driving technology advancements in autonomous vehicles, radar, and high-performance computing. During the panel discussion, you’ll learn about the next killer app and its potential impact of the semiconductor industry.
Hayes and Lujan also discuss all the networking opportunities and fund raising activities that you can take part in.
Contact our Guests on LinkedIn
Scott Hayes, Technical Director, NXP Semiconductors
Amy Lujan, Vice President, SavanSys
Registration for IMAPS DPC can be found here. You can also register for the Golf Tournament and Hike for DEI at the same time.
If you’d like to participate in the 3D InCites Member and Guest Event – the Backyard Olympics, sign up here. There is no charge to participate, and space is limited.
International Women’s Day is March 8th, and to celebrate, we’re partnering with SEMI to bring you an episode on how companies are fostering and implementing DEIB and allyship in their corporate culture. We’re looking for a few mentor/mentee pairs who are interested in sharing there story, as part of the episode. If you’d like to participate, drop me a line at francoise@3DinCites.com. Interviews must take place by February 23 to be included.
How to Start a Podcast Guide: The Complete GuideLearn how to plan, record, and launch your podcast with this illustrated guide.
IMAPS Device Packaging Conference
Interconnects for Tomorrow’s Applications
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
The International Microelectronics and Packaging Society’s Device Packaging Conference (IMAPS DPC) celebrates its 20th year this year. The conference takes place March 19-21, in Fountain Hills, AZ.
In this episode, Françoise von Trapp speaks with Scott Hayes, General Chair, IMAPS DPC, and Amy Lujan, General Chair-Elect of IMAPS DPC about the history of this event, and what sets it apart from IMAPS annual Symposium.
This year’s event will focus on heterogeneous integration and growth drivers for packaging, with speakers from companies like AMD, Intel, Facebook Reality Labs, and more. The General Business Council session will focus on Chips for America funding, doing business in China, and the significant growth of the U.S. semiconductor supply chain, particularly in Phoenix, AZ.
You’ll learn about the key applications driving technology advancements in autonomous vehicles, radar, and high-performance computing. During the panel discussion, you’ll learn about the next killer app and its potential impact of the semiconductor industry.
Hayes and Lujan also discuss all the networking opportunities and fund raising activities that you can take part in.
Contact our Guests on LinkedIn
Scott Hayes, Technical Director, NXP Semiconductors
Amy Lujan, Vice President, SavanSys
Registration for IMAPS DPC can be found here. You can also register for the Golf Tournament and Hike for DEI at the same time.
If you’d like to participate in the 3D InCites Member and Guest Event – the Backyard Olympics, sign up here. There is no charge to participate, and space is limited.
International Women’s Day is March 8th, and to celebrate, we’re partnering with SEMI to bring you an episode on how companies are fostering and implementing DEIB and allyship in their corporate culture. We’re looking for a few mentor/mentee pairs who are interested in sharing there story, as part of the episode. If you’d like to participate, drop me a line at francoise@3DinCites.com. Interviews must take place by February 23 to be included.
How to Start a Podcast Guide: The Complete GuideLearn how to plan, record, and launch your podcast with this illustrated guide.
IMAPS Device Packaging Conference
Interconnects for Tomorrow’s Applications
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
