3D InCites Podcast
As a semiconductor industry community, IMAPS 3D InCites content platform and podcasts brings to life the people, the personalities, and the minds behind heterogeneous integration and related technologies in a uniquely personal way. The goal is to inform key decision-makers about progress in technology development, design, standards, infrastructure, and implementation. The IMAPS 3D InCites Podcast provides a forum for our community members to discuss all kinds of topics that are important to running a business in the semiconductor industry, from marketing to market trends, important issues that impact our industry, and our success stories.
3D InCites Podcast
The AI Explosion, Chiplet Architectures, and Enabling the Future of Moore’s Law: Conversations from IMAPS DPC 2024
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This episode was recorded live at the IMAPS Device Packaging Conference in Fountain Hill AZ, where several of the keynote talks focused on chiplet architectures and heterogeneous integration for semiconductor device manufacturing, assembly, test, and packaging.
Françoise von Trapp talks with Arvind Kumar, of 3D InCites member company, IBM and Hemanth Dhavaleswarapu of AMD, about chiplet application drivers, such as artificial intelligence. She then talks to Pooya Tadeyon, of Intel, to find out why we are moving to advanced packaging, and particularly chiplet architectures, to enable the future of Moore’s law.
You’ll learn about:
- Chiplets architectures for high-performance applications
- How chiplets can enable foundational AI models that can be applied to various business use cases
- Challenges in chiplet design and test
- The importance of open interface standards
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Next week, our coverage of IMAPS continues, as we bring you conversations from the Global Business Council, which focused on repatriating the US microelectronics industry. You’ll get perspectives from academia, the government, and industry.
IMAPS InternationalIMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.
IMAPS Device Packaging Conference
Interconnects for Tomorrow’s Applications
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