3D InCites Podcast

The AI Explosion, Chiplet Architectures, and Enabling the Future of Moore’s Law: Conversations from IMAPS DPC 2024

March 28, 2024 Francoise von Trapp/Multiple Guests Season 4 Episode 9
The AI Explosion, Chiplet Architectures, and Enabling the Future of Moore’s Law: Conversations from IMAPS DPC 2024
3D InCites Podcast
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3D InCites Podcast
The AI Explosion, Chiplet Architectures, and Enabling the Future of Moore’s Law: Conversations from IMAPS DPC 2024
Mar 28, 2024 Season 4 Episode 9
Francoise von Trapp/Multiple Guests

This episode was recorded live at the IMAPS Device Packaging Conference in Fountain Hill AZ, where several of the keynote talks focused on chiplet architectures and heterogeneous integration for semiconductor device manufacturing, assembly, test, and packaging. 

 Françoise von Trapp talks with Arvind Kumar, of 3D InCites member company,  IBM and Hemanth Dhavaleswarapu of AMD, about chiplet application drivers, such as artificial intelligence. She then talks to Pooya Tadeyon, of Intel, to find out why we are moving to advanced packaging, and particularly chiplet architectures, to enable the future of Moore’s law. 

You’ll learn about: 

  • Chiplets architectures for high-performance applications 
  • How chiplets can enable foundational AI models that can be applied to various business use cases
  •  Challenges in chiplet design and test 
  • The importance of open interface standards 

Contact our guests on LinkedIn:

Next week, our coverage of IMAPS continues, as we bring you conversations from the Global Business Council, which focused on repatriating the US microelectronics industry. You’ll get perspectives from academia, the government, and industry. 

How to Start a Podcast Guide: The Complete Guide
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IMAPS International
IMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.

IMAPS Device Packaging Conference
Interconnects for Tomorrow’s Applications

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Show Notes Chapter Markers

This episode was recorded live at the IMAPS Device Packaging Conference in Fountain Hill AZ, where several of the keynote talks focused on chiplet architectures and heterogeneous integration for semiconductor device manufacturing, assembly, test, and packaging. 

 Françoise von Trapp talks with Arvind Kumar, of 3D InCites member company,  IBM and Hemanth Dhavaleswarapu of AMD, about chiplet application drivers, such as artificial intelligence. She then talks to Pooya Tadeyon, of Intel, to find out why we are moving to advanced packaging, and particularly chiplet architectures, to enable the future of Moore’s law. 

You’ll learn about: 

  • Chiplets architectures for high-performance applications 
  • How chiplets can enable foundational AI models that can be applied to various business use cases
  •  Challenges in chiplet design and test 
  • The importance of open interface standards 

Contact our guests on LinkedIn:

Next week, our coverage of IMAPS continues, as we bring you conversations from the Global Business Council, which focused on repatriating the US microelectronics industry. You’ll get perspectives from academia, the government, and industry. 

How to Start a Podcast Guide: The Complete Guide
Learn how to plan, record, and launch your podcast with this illustrated guide.
IMAPS International
IMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.

IMAPS Device Packaging Conference
Interconnects for Tomorrow’s Applications

Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.

Support the Show.

Become a sustaining member!

Like what you hear? Follow us on LinkedIn and Twitter

Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

(Cont.) The AI Explosion, Chiplet Architectures, and Enabling the Future of Moore’s Law: Conversations from IMAPS DPC 2024