3D InCites Podcast
IMAPS Global Business Council: Repatriating the U.S. Semiconductor Ecosystem
This episode was recorded live at IMAPS DPC, where the Spring version of the Global Business Council focused on Geopolitics Fueling the Repatriation of the Semiconductor Ecosystem. To get the complete picture of the collaboration happening, Françoise von Trapp speaks with representatives of the government, industry, and academia.
Dan Berger, National Advanced Packaging Manufacturing Program (NAPMP), explains how CHIPS Acts monies are being used to address gaps like advanced packaging and substrate manufacturing, to help revitalize the US semiconductor industry. The focus is on developing domestic manufacturing teams for U.S. leadership in microelectronics, with global collaboration and security in mind. He discusses the importance of advanced packaging roadmaps aimed at scaling down feature sizes, eliminating interposers and integrating chiplets directly onto substrates.
Zachary Holman, of Arizona State University, discusses how ASU’s Fulton School of Engineering is working to advance the college’s research impact in areas such as health, climate, and national security through partnerships with government and industry investments. He highlights ASU’s focus on extending the advanced packaging capabilities of its MacrotTechnology Works (MTW) fab, which allows for larger-scale packaging tools and pilot-to-fab gap closure.
Holman emphasized the importance of providing hands-on experience with state-of-the-art tools and materials for students. This will help provide a skilled workforce that can operate and maintain the latest equipment. Holman also discussed how ASU is building a platform to democratize innovation by providing access to R&D capabilities for startups and small businesses.
Mark Litecky, of Skywater, highlights the need for secure supply chain management and proprietary technology management in the U.S. semiconductor industry. He also stressed the importance of having global capabilities and secure supply chain management in the US, while avoiding duplication in different regions.
Litecky also highlighted workforce development, emphasizing the need for more people to understand the value of the field and the various career paths available.
Contact the Panelists on LinkedIn
- Dan Berger, Associate Director, NAPMP
- Zachary Holman, Vice Dean, Arizona State University
- Mark Litecky, Chief Revenue Officer, Skywater
Learn how to plan, record, and launch your podcast with this illustrated guide.
Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
This episode was recorded live at IMAPS DPC, where the Spring version of the Global Business Council focused on Geopolitics Fueling the Repatriation of the Semiconductor Ecosystem. To get the complete picture of the collaboration happening, Françoise von Trapp speaks with representatives of the government, industry, and academia.
Dan Berger, National Advanced Packaging Manufacturing Program (NAPMP), explains how CHIPS Acts monies are being used to address gaps like advanced packaging and substrate manufacturing, to help revitalize the US semiconductor industry. The focus is on developing domestic manufacturing teams for U.S. leadership in microelectronics, with global collaboration and security in mind. He discusses the importance of advanced packaging roadmaps aimed at scaling down feature sizes, eliminating interposers and integrating chiplets directly onto substrates.
Zachary Holman, of Arizona State University, discusses how ASU’s Fulton School of Engineering is working to advance the college’s research impact in areas such as health, climate, and national security through partnerships with government and industry investments. He highlights ASU’s focus on extending the advanced packaging capabilities of its MacrotTechnology Works (MTW) fab, which allows for larger-scale packaging tools and pilot-to-fab gap closure.
Holman emphasized the importance of providing hands-on experience with state-of-the-art tools and materials for students. This will help provide a skilled workforce that can operate and maintain the latest equipment. Holman also discussed how ASU is building a platform to democratize innovation by providing access to R&D capabilities for startups and small businesses.
Mark Litecky, of Skywater, highlights the need for secure supply chain management and proprietary technology management in the U.S. semiconductor industry. He also stressed the importance of having global capabilities and secure supply chain management in the US, while avoiding duplication in different regions.
Litecky also highlighted workforce development, emphasizing the need for more people to understand the value of the field and the various career paths available.
Contact the Panelists on LinkedIn
- Dan Berger, Associate Director, NAPMP
- Zachary Holman, Vice Dean, Arizona State University
- Mark Litecky, Chief Revenue Officer, Skywater
Learn how to plan, record, and launch your podcast with this illustrated guide.
Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.