3D InCites Podcast
As a semiconductor industry community, 3D InCites brings to life the people, the personalities, and the minds behind heterogeneous integration and related technologies in a uniquely personal way. The goal is to inform key decision-makers about progress in technology development, design, standards, infrastructure, and implementation.The 3D InCites Podcast provides a forum for our community members to discuss all kinds of topics that are important to running a business in the semiconductor industry, from marketing to market trends, important issues that impact our industry, and our success stories.
3D InCites Podcast
30 Years of Underfill Technology: How Societal and Technological Challenges Impact Materials Development
•
Francoise von Trapp / Richard Jensen
•
Season 4
•
Episode 28
In this episode, Françoise von Trapp and underfill materials expert, Dick Jensen, NAMICS corporation explore the societal and technological challenges that impact microelectronic materials development.
The conversation focuses on the evolution of underfill materials development over the past 30 years. They discuss the importance of underfill materials in semiconductor manufacturing, focusing on their compatibility, environmental impact, and properties.
You’ll learn about:
- The development of specialized underfill materials for advanced packaging technologies, including AI chips, and the challenges arising from material changes in electronics manufacturing
- Historical examples of working with restricted substances and how that created a need for alternative materials
- The current need for collaboration and innovation to address the issue of PFAS chemicals in products
- Why and how much testing is important to ensure material compatibility and performance
NAMICS Corporation provides advanced materials and solutions for the semiconductor industry.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.