3D InCites Podcast
As a semiconductor industry community, IMAPS 3D InCites content platform and podcasts brings to life the people, the personalities, and the minds behind heterogeneous integration and related technologies in a uniquely personal way. The goal is to inform key decision-makers about progress in technology development, design, standards, infrastructure, and implementation. The IMAPS 3D InCites Podcast provides a forum for our community members to discuss all kinds of topics that are important to running a business in the semiconductor industry, from marketing to market trends, important issues that impact our industry, and our success stories.
3D InCites Podcast
NXP’s Gulroz Singh Discusses The Semiconductor Industry’s Role in Ensuring Autonomous Vehicle Safety
Use Left/Right to seek, Home/End to jump to start or end. Hold shift to jump forward or backward.
As autonomous vehicles take to the roads, the jury is still out on the readiness of these vehicles in terms of safety. Technologies being used are still in nascent stages, and there is still work to be done before these vehicles can be operated in driverless mode.
In this episode, Françoise von Trapp sits down with Gulroz Singh, a renowned thought leader and expert in the automotive industry, specializing in the areas of autonomous driving safety, automotive functional safety, and semiconductor safety.
Listen in to learn about the challenges facing the autonomous vehicle industry in terms of safety, including the evolving vehicle architecture and the use of cloud-native technologies in safety-critical applications.
You’ll come away with a better understanding of potential safety and cybersecurity risks associated with over-the-air software updates for vehicles, and the need for robust safety and security mechanisms to prevent incidents from happening in the future.
You’ll also discover the challenges and opportunities presented by emerging technologies such as chiplet architectures, AI, advanced memory, and 5G in the automotive industry, and why there is a need for standardization in packaging and interconnects for chiplets to ensure compliance with automotive safety and cybersecurity standards.
About our Guest
Gulroz Singh is a certified professional in ISO 26262 and ISO 21434, two international standards for automotive safety. His passion for automotive innovation and safety is evident in his work, which can be found at www.gulrozsingh.com. Connect with Gulroz on Linkedin.
Join us next week on the 3D InCites Podcast, when I sit down with SEMI Europe’s Laith Altimime, and Imec’s Katrien Marent, to discuss Europe’s role in creating a $1T Semiconductor Industry.