
3D InCites Podcast
3D InCites Podcast
Onto Innovation's PACE Partners Talk About Collaborating on Panel-Level Packaging
On September 30, 2024, Onto Innovation held the grand opening of its Packaging Applications Center of Excellence - or as it's being called, PACE. Françoise von Trapp attended the grand opening to learn why the company has partnered with like-minded suppliers of the panel-level packaging ecosystem to accelerate the development of PLP technologies for both organic and glass substrates. These include 3D InCites Members: LPKF Laser & Electronics, Evatec, MKS-Atotech and Lam Research; as well as Resonac, Corning, and others.
This episode starts off with a conversation with Onto Innovation CEO, Mike Plisinski, who explains how PACE came to be, its business model, and why AI is driving growth in panel-level packaging.
The story continues with a tour of PACE conducted by Keith Best, Director of PACE. Best gives a step-by-step description of the processes as panels move from the photoresist coater, to the lithography
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