Chip Champions: How The 3D InCites Award Winners Are Revolutionizing Heterogeneous Integration

The 3D InCites Podcast celebrates microelectronics industry innovation with a special episode featuring this year's award winners in heterogeneous integration and chiplet technology.

• SallyAnn Henry, Jim Straus and David Wang, ACM Research, describe a horizontal rotation plating system for panel-level packaging with superior uniformity across square substrates
• Eric Gongora, of MacDermid Alpha, explains how NovaFab fine-grained copper enables hybrid bonding with customizable annealing times and improved electron migration resistance
• Chuck Woychik, NHanced Semiconductors, talks about how the company brings hybrid bonding capabilities onshore with expertise in wafer processing for both defense and commercial applications
• Keith Felton, Siemens Digital Industries Software, introduces Innovator 3DIC for hierarchical device planning that automatically propagates design changes throughout chiplet interfaces
• Kazuyuki Mitsukura explains how Resonac builds collaborative consortia in Japan and the US to solve complex advanced packaging challenges through shared resources
• Rex Anderson from Micross shares his engineering journey and passion for mentoring the next generation of technologists
• Ron Huemoeller and Eelco Bergman discuss how Saras Micro Devices addresses AI power challenges with embeddable S-Tile capacitors. They also talk about Saras corporate culture.

EV Group
EV Groups supplies high-volume equipment and process solutions for semiconductor manufacturing.

KLA, SPTS Division
KLA provides semiconductor equipment for metrology, inspection, wafer processing, and more.

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Chapters

• 0:08 Episode Introduction
• 0:50 ACM Research: Horizontal Rotation Plating
• 9:21 MacDermid Alpha: Chemistry for Hybrid Bonding
• 18:50 NHanced Semiconductors: 3D Hybrid Integration
• 24:14 Siemens: Hierarchical Device Planning Tool
• 33:41 Resonac: Joint Consortium Initiative
• 39:28 Rex Anderson: Engineer of the Year
• 48:09 Saras Micro Devices: Vertical Power Delivery
• 58:30 Episode Wrap-up