3D InCites Podcast
3D InCites Podcast
Acoustic Inspection: The Key to Semiconductor Reliability
Acoustic inspection stands as a silent sentinel in semiconductor manufacturing, detecting microscopic defects that could lead to catastrophic failures in high-value applications. Bryan Schackmuth, Senior Product Line Manager at Nordson Test and Inspection, reveals how this technology has evolved from laboratory tools to production-line essentials.
When ultrasound encounters even the tiniest air gap—we're talking hundreds of angstroms—it reflects completely, making acoustic imaging uniquely powerful for evaluating bonds between materials. While optical inspection shows surface defects and X-ray reveals density variations, acoustic inspection peers between layers, identifying delamination and other hidden flaws that might otherwise escape detection until field failure.
The challenges of advanced packaging have driven significant innovation in acoustic inspection technology. As manufacturers stack more die, create complex interconnects, and push toward heterogeneous integration, the value of each wafer increases dramatically. Nordson's SpinSam system represents a breakthrough in this space, replacing traditional raster scanning with a rotational approach that achieves 41 wafers per hour—eight times faster than previous generation technology—while maintaining resolution down to 10 microns.
Beyond pure speed, the system's spinning scan technology offers unique advantages for edge inspection where defects are more common due to coefficient of thermal expansion effects. The modular design allows maintenance on individual scanners while others continue operating, maximizing uptime in production environments. Most exciting is the integration of AI and machine learning for defect detection, moving beyond simple thresholds to analyze complex multilayer images simultaneously.
Want to see how your inspection strategies might benefit from these advances? Check out Nordson's SpinSam technology at nordson.com and discover how acoustic inspection is helping manufacturers achieve higher yields and more reliable products in today's most demanding semiconductor applications.
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This episode of the 3D Insights Podcast is sponsored by Norton Test and Inspection leaders in acoustic, optical and x-ray inspection and metrology systems for the semiconductor and SMT manufacturing markets. Norton's next-generation SpinSam acoustic microimaging system combines breakthrough scanning capability with best-in-class defect capture and image quality to enhance both productivity and accuracy for 100% semiconductor inspection. The system sets an industry benchmark for high throughput and superior sensitivity, enabling precise defect detection in wafer-based assemblies. Learn more at Nordsoncom. Hi there, I'm Francoise von Trapp, and this is the 3D Insights Podcast. Hi everyone, this week we are talking about how acoustic inspection is becoming a key tool in the semiconductor wafer and package inspection toolbox. Now, as semiconductor devices become more complex, their value is increasing at each step of the manufacturing process, and that's why 100% inspection is becoming critical at all stages. There are options like optical, x-ray and acoustic imaging, and these are all important methods that help ensure package reliability. So to learn more about this, I've invited Brian Schachmuth of Nords Intestine Inspection to join me on the podcast. Welcome, Brian.
Bryan Schackmuth:Hey, thank you for having me Good to be here.
Françoise von Trapp:So thanks for joining us from Korea. I know it's early in the morning there. Really appreciate your time. So before we get started into our topic, can you just tell me a little bit something about yourself and your role at Nordsen Test and Inspection?
Bryan Schackmuth:Sure. So currently I'm the Senior Product Line Manager for Acoustic Products at Nordsen Test and Inspection acoustic products. At Norton Test and Inspection we're part of the bigger segment called ATS, which has three businesses the EPS, which is like a Syntec dispensing, xrt, which is X-ray and test, and then the division I'm in is OSM Optical Sensor Metrology. Our main products are acoustic and optical inspection as well as wafer sense. So I've been with Sonoscan, which was acquired by Norton, for 28 years now, so just recently over the last year, taking the product line manager role.
Françoise von Trapp:Okay, so you were at Sonoscan like 10, 15 years ago when acoustic microimaging really started hitting the market.
Bryan Schackmuth:Yeah, so I mean basically back then it was mostly offline, manual type systems, and then, I would say probably 10 years ago, we really started to get into more of the production because of that need for inspection that you were talking about.
Françoise von Trapp:Right, okay, so there is a history of using all of these types of inspection in R&D and development, right? And that's what you were talking about with the manual inspection.
Bryan Schackmuth:Yeah, so you typically find a lab-type system. It's manual loading, manual unloading in the R&D lab, in failure analysis and then also in new product development While they're designing it, once it's in the field and then any type of field returns. We would do the acoustic inspection first because it's non-destructive, so they don't have to damage the sample and they can look inside to see any type of defects first before they would go and cut the sample.
Françoise von Trapp:So can you actually just give us a high-level explanation of those three different types of inspection?
Bryan Schackmuth:Sure explanation of those three different types of inspection. Sure, so acoustic again, using ultrasound. Typically we're anywhere from maybe 15 megahertz up to about 300 megahertz At that high frequency. The key thing about ultrasound is it won't travel through air. So once we hit an air gap we get a hundred percent reflection, basically a big signal back. Even down to hundreds of angstroms the thickness of an air gap will be enough to stop the ultrasound. That makes it a very good technique for bond evaluation. So any type of materials that are supposed to be stuck together, if they're separated we can see it. X-ray is very good at seeing variation in density. So like a very thin crack X-ray would not be able to see, but a solder ball or a wire bond or a via they can see very easily because of the variation in the density. Acoustically we would have problems with that small of a feature. And then optical is really for surface level defects what you can visually see it doesn't look inside the sample like x-ray or acoustic.
Françoise von Trapp:So all of these three are important to the manufacturing process. Why is that?
Bryan Schackmuth:We don't compete with these different things. Most customers in an FA lab would have x-ray, acoustic and optical, or have all three, depending on the application. You might use one more than the other. X-ray has some limitations as far as, like memory devices, x-rays will damage the memory chips. You can still do analysis on those as well.
Françoise von Trapp:I always think about acoustic and sonogram as being used in medical situations. Right For all sorts of measuring density. So there's usually some sort of fluid involved. How does that work in the microelectronic space?
Bryan Schackmuth:Sure. So, like I mentioned, ultrasound won't travel through air, right. So we need something to couple the ultrasound to the sample. In medical they use the gel and it's really more of a surface contact type transducer For the acoustic. We can't touch the sample, so we're using deionized water. It's readily available. It's very safe. You can either put the sample in a water bath like a water tank, or one of the things that Norton has for our systems is a waterfall. So instead of immersing the sample in water, we kind of cascade or jet water just where we're inspecting, so that minimizes the exposure to water. So if you have some type of defects that are exposed to the outside edge, water could potentially get inside the sample. So waterfall helps to minimize that chance.
Françoise von Trapp:Okay, so you know what are the trends that you're seeing in the wafer-level packaging that is impacting the needs of these different types of inspection.
Bryan Schackmuth:We've seen significant growth in that advanced packaging. So whether it's system-in package, fan-out, wafer-level package or heterogeneous packaging, the market is really driving to put as much as possible into the smallest form factor as possible. It's getting much more complex. With that complexity comes along the chance for defects to be introduced at all the different stages, and so if we can get in on those earlier stages, we can help to screen out the defects, which improves the customer's yield and they don't have to further process a known defect earlier in the process.
Bryan Schackmuth:Right, so we're weeding out the potential failures Exactly.
Françoise von Trapp:Are we doing rework on those, or is that pretty much just a sorting process?
Bryan Schackmuth:Yeah, typically when we're looking at a wafer, we'll map the wafer, give the location of the defects so that further down the process we'll communicate with their factory host. We'll tell them OK, this chip A, b and C are defects. Those chips will not get any further processing downstream.
Françoise von Trapp:So you don't lose the whole wafer. You're able to select, and that's what we're talking about. Known good die yeah, correct, ok. Able to select, and that's what we when we're talking about. Known good dye yeah, correct, okay. Beyond, like r&d. Now we're starting to see the use of these tools. Can you give me some example of how these are used actually in situ in the manufacturing environment?
Bryan Schackmuth:sure. So you know, for the wafer inspection we're looking at various applications, but essentially it's a bonded wafer. You know. So historically, many years ago a wafer was essentially two dimensions. You had the XY and then you had one layer of metallization for the chip. You know, with this advanced packaging they're now going in the third dimension. You know they're stacking devices. So each layer when you stack you have a bond interface and so that's what we're stacking devices. So each layer when you stack you have a bond interface, and so that's what we're looking at. So it could be as simple as silicon on insulator or SOI. That's just two bonded wafers. We'll look at that bond interface. It could be the more complex MEMS devices where you have multiple layers and then you get into the stack die and TSV. They're doing eight stack, 16 stack. So we'll be looking at those different applications, determining if there's defects in there and then mapping that out and providing that to the customer and you're using the acoustic imaging for that.
Françoise von Trapp:Correct, yeah, okay, so what would be an example of when you would use optical or x-ray in the manufacturing environment?
Bryan Schackmuth:M8000, which is for wafer application X-ray. X-ray is much higher resolution. They can get down sub-micron Acoustic. We're probably down to around the 10-micron resolution. So with X-ray at that very high resolution they'll go in and look at the TSV because they're well-suited to look for that variation in the density. So they'll look for much smaller defects. But typically they're doing kind of a spot check. They wouldn't be doing a full scan of the whole wafer because of that very high resolution.
Françoise von Trapp:So we're using all three of these in manufacturing now.
Bryan Schackmuth:Correct.
Françoise von Trapp:So what determines when one would be chosen over another, or is it not like that?
Bryan Schackmuth:A little bit like that. Like I mentioned, if it's a memory application in production, you can't use x-ray.
Françoise von Trapp:Right, okay.
Bryan Schackmuth:There are some things you can do to mitigate the effects of the x-ray on memory. But typically they wouldn't be using X-ray for memory but for acoustics. It's anytime they want to see that level-to-level inspection. So the benefit of acoustic is we can isolate layer by layer so we can look at the top layer, the middle layer, the bottom layer and provide different sets of images for each of those layers. That helps them to kind of investigate where the defect is. Is it at their higher levels? You know, maybe they have a process where they need to go back and refine the process to help that top layer adhesion.
Françoise von Trapp:So there are different types of defects, and I know one of them is latent defects, which are not as obvious, something where a device is going to fail down the road in use.
Bryan Schackmuth:Typically we might see a defect and it might be a small, let's say delamination. It was two layers that are supposed to be bonded together and if you have a small defect as this chip gets processed, you know there's the chemical, mechanical polishing. Those defects can sometimes cause almost like a blistering effect or a slight bubble, and as you grind it that defect can kind of expand it. Can you know, as you polish the surface that'll expand that defect. So there's certain cases where we would see defects that you know would grow over time. If it gets into a package and it goes into automotive you're talking about extreme temperature variation and so that expansion and contraction can make that defect grow.
Françoise von Trapp:So, basically, the acoustic micro-imaging is making it possible for you to find these defects way sooner and pull them out of the line, so that you don't even get to the point of where they're going to get bigger.
Bryan Schackmuth:Exactly. You know it depends on the market. If the chip is going into a toy, you know that's not high reliability. If it's going into a medical or surgery, or if it's going in on a satellite in space, it's very expensive to repair. So the 100% inspection is geared more towards that high-end, high-expensive devices.
Françoise von Trapp:So if you're weaving out the smaller defects for the 100% inspection, can those get shipped off to A use this? This one's not a complete loss. You can use this in a toy, I mean, do they do?
Bryan Schackmuth:that they wouldn't even start with that application from the start.
Françoise von Trapp:Wouldn't that be great though. So how has traditional acoustic technologies, then, been improved over the years?
Bryan Schackmuth:Yeah, so traditionally the type of scanning that's been done for acoustic microscopes and this is, you know, since I've been with the company 20 years is an XYZ raster scan. Imagine kind of an inkjet printer scanning back and forth over the paper, printing. We're doing the same thing, but an XY over a sample and generating an image. It's that back and forth motion. We use a transducer is what's called. That generates the ultrasound, moves to the left, it stops, it accelerates to the right, it stops, it accelerates to the right, it stops and it goes back and forth. So at the edges of the scan you're constantly stopping, so you're not acquiring data. The spin Sam, what that does is a rotational or spinning scan. So we start in the middle, we spin the wafer and we just move to the edge. I would say like a record player but that would be dating myself or like a CD player.
Françoise von Trapp:You can say record player. Well, I was just thinking about the difference between scans. When my kids I had twins and when I was pregnant, you couldn't tell what baby was new, and now you see these amazing images where they can really see what the baby looks like. So you know, take that and put that into the wafer application. I would imagine like the resolution is a lot better.
Bryan Schackmuth:Yeah. So we've improved kind of the frequency you know, going to higher frequency. Generally speaking you would say lower frequency is lower resolution but it can go through more material. Higher frequency is higher resolution but it can go through more material. Higher frequency is higher resolution but it can't go through as much material. So we've improved the transducer design, optimized the frequency and the lens shape to optimize the focal spot so we can get that much higher resolution, and then, along the way, you know, making improvements to the RF chain that generates the ultrasound, maximizing, you know, the output of the signal, as well as minimizing, you know, signal to noise ratio.
Françoise von Trapp:So you mentioned SpinSam, which is a fairly new product for NORD's intestine inspection.
Bryan Schackmuth:Yeah, it was just released last year towards the end of FY24. That's our 100% 300-millimeter wafer inspection tool, really geared for high throughput in the wafer inspection area.
Françoise von Trapp:For the purposes of our audience? How can it be used to address the needs of wafer-level packaging and advanced packaging?
Bryan Schackmuth:Due to the complexity of these samples and the wafers themselves, the cost is extremely high, so they really need high reliability. You can put the SpinSam system in your facility and do 100% inspection on these samples. A lot of the stuff we're looking at today is stack dye, whether 8-stack or 16-stack these samples A lot of the stuff we're looking at today is stacked die, whether you know eight stack or 16 stack.
Françoise von Trapp:And again, it's all about finding those defects kind of early on in the process.
Bryan Schackmuth:So that's the memory application. Yeah, correct, Then just standard bonded wafers. One thing we've seen is a temporary bond. So they'll use kind of a carrier wafer and they'll temporarily bond a processed wafer on there. That carrier wafer will basically act like a substrate for the actual wafer. So we'll inspect that temporary bond because if the temporary bond is not good you could potentially induce defects into the sample later.
Françoise von Trapp:So what about like fan out wafer level packaging? Is that an application space where the spin sam would be helpful for like doing inspection on RDL layers?
Bryan Schackmuth:In the wafer area they build up the fan out wafer level package so we can look at those different layers, the dielectric layers, the low K dielectric or the redistribution layer, and then eventually that wafer would get cut and diced and then that would be put onto a substrate that goes into kind of the final package. At that stage we would go from our wafer inspection to more of our tray inspection system, more of a backend process to look at that final assembly.
Françoise von Trapp:Okay, so the spin sam is definitely for the wafer itself.
Bryan Schackmuth:We wouldn't say it's very front end, we would say more like middle end. So front end is more of like your UV processing, metal deposition and that we're kind of after that process where they start stacking those wafers.
Françoise von Trapp:Okay, so it's the finding. The known good die before is where it's used. It's not for final package inspection.
Bryan Schackmuth:Correct. Yeah, so definitely before. If there's a thousand die on the wafer, using the acoustic microscope they can pick out those defect parts and then, you know, put them into a reject bin. There's no use in packaging that into the final assembly, saving your time.
Françoise von Trapp:Okay, that's good to know, cause when you were talking before about the spin process, I was thinking about how things are shifting to panel level packaging and how would that be adapted for use in panel level packaging. But you're actually using it before we even get to that die placement on the panel.
Bryan Schackmuth:Correct. Yeah, we would have a large area scanner because you can use the acoustic microscope through the different stages. At the wafer level it gets diced, gets put into a package, but then we would go to a different form factor for the acoustic inspection. You know a large area scanner. Typically we would be doing lower resolution at that stage, lower frequencies, maybe 30 megahertz, 50 megahertz, 100 megahertz, because the defect size is not as critical in the, you know, back end.
Françoise von Trapp:Okay, so that would be a different tool than the SpenSam.
Bryan Schackmuth:Correct.
Françoise von Trapp:Okay, so let's talk about the SpenSam a little more. Can you give me some of the benefits? Things like UPH, speed resolution, edge scanning capabilities, things like that.
Bryan Schackmuth:Sure. So the driving reason that we went to develop the SpenSam is so we had a previous product, a wafer inspection system AW300, using that traditional raster scan. But really the push was to optimize throughput. But we kind of pushed it even farther. What we want to look at is wafers per hour, per footprint. So clean room space is very expensive, so we want to maximize the throughput in the smallest footprint. So we want to maximize the throughput in the smallest footprint. So with that spin scan we can get at 100 micron resolution about 41 wafers per hour, which is, I think, eight times faster than our previous machine. And then the resolution. So currently the spin scan can go down to about 10 micron resolution. So you can do that full 300 millimeter wafer at a 10 micron pixel. Again, the way we're scanning it, because of that spinning scan we can do, you know, an edge scan, or you can think of it kind of like a donut. Or if I go back to the record player playing the last track, on the record.
Bryan Schackmuth:You could never do that type of scan with a traditional raster scan, like you could never do that type of scan with a traditional raster scan. You know we're just doing a ring around the outside of the wafer and the reason that's important is the coefficient of thermal expansion when you're doing the bonding process is more extreme at the edges Right, and so customers are seeing that the edge of the wafer is where they're finding more defects. In the center of the wafer we might not see as many defects because that's easier to bond. And so with the SpinSam it's very well suited to do a lower resolution scan in the center, where you don't expect defects, and then maximize the resolution towards the edge to see those edge defects. And that all goes to improving yield. If they can isolate those defects at the edges, remove those dye from the process.
Françoise von Trapp:Okay. So while they're doing that in the volume setting and basically identifying the defects and removing them, are they also getting any knowledge that they can feed back to the process guys to say, hey, we keep seeing this happen over and over. Can you tweak the process?
Bryan Schackmuth:Definitely so. The acoustic wave again, like I mentioned, you can isolate layers so as the ultrasound travels it travels in time and then we can basically pick regions of time to look at. If they see a trend that defects are occurring at the base layer or the deepest layer, a trend that defects are occurring at the base layer or the deepest layer, you know they might go back into their process and say what is it about the process that's causing these defects? Just at this layer? We're not seeing it at the upper layers, it's always at this lower layer. And so they might find that, you know, they have some unintended particle generation that's putting particles at the edge of the wafer during that process and those particles then cause the defects. So they can go back and kind of maximize their process earlier on to minimize defects down the road.
Françoise von Trapp:Yeah. So that's great because they're not just using it to remove the defects and that immediate yield, they're actually taking that information for improving yields in the future.
Bryan Schackmuth:Yeah, and improving their process altogether.
Françoise von Trapp:Right, okay, so I was reading through some of the information about the SpinSam and there's something called global tool matching. What is that and why is it important?
Bryan Schackmuth:So the SpinSam has four scanners, so there's four scan stages. There's a eFEM that loads all the wafers, so we're using four different transducers. There can be slight variations in the transducers, so what global tool matching does is it's basically a matching network. So it'll look at the signal of all four transducers and to do this we have kind of a reference wafer that we'll use. So it's a you could call it kind of a calibration wafer that'll go on each of the four scanners. We take that reference measurement and then we optimize the signal so that everything is matched. So kind of the end goal is, if you have a spin SAM in Singapore running a wafer and that same spin SAM in Taiwan running a same wafer, what we want to achieve is the same recipe, same system, same wafer, same result, so that multinational companies can use the same data set or the same parameters and not have to change or modify depending on the system.
Françoise von Trapp:Okay, and what about maintenance?
Bryan Schackmuth:Yeah, so another key thing that we were trying to design into the SpinSAM system is its modular design. So each of those four scanners I mentioned is a scan module, and then there's also another RF module which generates the ultrasound. And so with that modular design you can take one scanner offline to do preventative maintenance or servicing, but the other three scanners will continue to run Traditionally. If you had to do preventative maintenance, the whole machine goes down and you lose 100% of your throughput.
Bryan Schackmuth:With modular design on SpinSan, we can take each scanner offline, one at a time, but the other three scanners can continue to scan, and so it makes it much easier to service, as well as minimizing the downtime on the system.
Françoise von Trapp:Are there any other advantages to being modular design besides that?
Bryan Schackmuth:In the future, if we were to develop, you know, higher frequency, let's say, or develop a new RF feature that gives a better image, we can just remove that RF module in the spin sand and upgrade it to the latest RF module, and so you don't have to replace the whole system to get the latest image capability. We're looking at ease of repairability as well as ease of upgradability in the future.
Françoise von Trapp:One of the things we've been talking a lot about with different member companies is integrating machine learning, ai and digital twin technology into their tools. Is there any of that involved with the spin Sam?
Bryan Schackmuth:Yeah, that's a great question. So traditionally we've had a software package called DIA, digital image analysis. It's using a threshold. So you have a, imagine, a grayscale image. You set a threshold, so typically the defects are bright, or, you know, we get a large reflection so we have a bright defect. So we would say any pixel that's brighter than a certain value is a defect. That was good when the devices were simple. But with today's complex layering, the contrast in the images is no longer easy to use a simple threshold technology.
Bryan Schackmuth:So there's a team at Norton, you know they work with that whole segment, all three divisions, and they're really developing the AI ML for us and so for the acoustic system we've already introduced kind of the first rendition of the what's called MGIA or multi-gate image analysis, and so instead of setting that threshold, there's applications today where if you set a threshold you'll get either overkill or underkill, meaning you're going to reject too much or you're not going to catch the defect. But with the AIML we can go through and teach the system what a defect is and then you know with the machine learning over time you can build up a robust model that be able to isolate the defects but not overkill or underkill, and so that's been introduced. It can do. The MGI is multi gate, meaning multiple images, so you can take, you know, three images, stack them all together and then analyze that as a whole package. So it's really been useful for, you know, for the more complex structures that we're seeing today.
Françoise von Trapp:Are you getting more of a 3D image with that, then?
Bryan Schackmuth:We can do 3D Typically. That takes a little bit longer so it's not really done in production. But what they'll do is if an operator looks at the three images, they're looking kind of one by one. If an operator looks at the three images, they're looking kind of one by one, and so they might see a defect in the first one, nothing in the second one, maybe something in the third image. What the AIML can do is look at all of them at the same time, and so it might see a defect at the first layer and the second layer, but then, looking at both of those at the same time, it can interpolate. Maybe that defect actually goes through the middle layer, and so it can really see more than an operator would be able to see.
Françoise von Trapp:So what does this do as an advantage over a tool that wouldn't have that?
Bryan Schackmuth:We've seen applications, you know, in the past where an operator is doing that analysis, because the contrast is not good enough to do the traditional threshold. It's an operator making that decision, and so you introduce a certain element of human error. Right, okay, no if it's close to lunchtime, maybe they're thinking about lunch and not thinking about the defects in the wafer.
Françoise von Trapp:That would be me. So does it speed up the process, makes it more accurate? Yeah, definitely so, speeding up the process makes it more accurate?
Bryan Schackmuth:Yeah, definitely so. Speeding up the process, automating it you know a lot of our customers are driving towards that lights out factory, where they don't want operators making any decisions and then also for the traceability. So you know, all the wafers are traced, we're communicating with the host and the manufacturing site and so all that data goes along with that wafer.
Françoise von Trapp:Okay, so is the SpinSam a one-of-a-kind in the industry, or are there competitive offerings?
Bryan Schackmuth:I would say it's one-of-a-kind because of that spinning technology. So any of the competitive offerings and even our older generation system are using that raster scan. So there's really no way they can catch up to the throughput and footprint. When you're doing that raster scanning you have a mechanism, a gantry over the wafer and so you have a lot of moving parts on top of the wafer, which is not ideal for particle generation because you'll have bearings or belts or motors over the surface of the wafer. Particles would tend to drop on the wafer. With SpinSam we just have one transducer that just moves from the center to the outer edge, so we don't even have any moving parts essentially over the top of the wafer. So it really minimizes particle generation for the clean room environment.
Françoise von Trapp:So because you don't want to introduce something that would cause a defect further down the line during the inspection process. That would be counterproductive, correct, okay? Last question for you what can the customers gain by installing the SpinSam in their facility?
Bryan Schackmuth:Yeah. So I would say Spin SAM has best-in-class wafer per hour at 100 microns, 41 wafers per hour, and then in our roadmap we're going to be targeting about two times that throughput and that'll be coming kind of towards the end of this year. The next thing would be the defect detection, so we can see down to that 10 micron defect size and we can do it in a very small form factor. So it's really about wafers per hour per footprint, so maximizing the cost of ownership of the system, and then the quality standards, so the ability to do that global tool matching, to have each system match, no matter where it is, with any facility across the globe.
Françoise von Trapp:Okay, so where can people go to learn more?
Bryan Schackmuth:Yeah, so you can go to nortoncom and look up SpinSam. You'll see probably my face.
Françoise von Trapp:We'll put a link in the show notes so people can find it. Thanks so much. It's been a while since I've talked about acoustic microimaging, so it was kind of fun to catch up on that. So I really appreciate your time.
Bryan Schackmuth:Thanks for having me. I really appreciate the time together.
Françoise von Trapp:If you want to learn more about semiconductor inspection, be sure to mark your calendars for an interview with Norton Test and Inspections' Andrew Mathers to learn all about dynamic planar CT with automated x-ray systems dropping May 16th. There's lots more to come, so tune in next time to the 3D Insights podcast. The 3D Insights podcast is a production of 3D Insights LLC.