How Wide Bandgap Materials Are Rewiring Energy Efficiency

Power electronics are quietly rewriting the rules of energy use—from the range of your EV to the efficiency of a hyperscale data center. Françoise sits down with Henkel’s Ram Trichur to unpack what’s driving the $67.5B surge in power semiconductors and why the move to wide bandgap materials like silicon carbide and gallium nitride is such a big deal. 

We break down the real differences between logic and power devices, then dive into where innovation is happening right now: die attach materials, thermal pathways, and manufacturing processes that can keep up with higher power densities. Ram explains why traditional wirebond packaging remains dominant in power, even as modules climb from 400 V to 800 V and beyond. You’ll learn how the industry is moving from solder to silver sintering for performance, and why copper-based sintering may be the breakthrough that balances cost, reliability, and manufacturability.

From discrete devices to full power modules, we explore the challenges of thinner die, copper leadframes, backside metallization compatibility, and bond line control. Ram shares Henkel’s roadmap for pressure-assisted copper sintering at lower temperatures and pressures in nitrogen, the multi-year qualification path customers expect, and how early sampling shortens time to scale. If you care about EV range, charger efficiency, industrial uptime, or greener data centers, this conversation connects the dots between materials science, packaging engineering, and system-level performance.

If you enjoyed this deep dive, follow the show, share it with a colleague who cares about SiC and GaN, and leave a quick review to help others find us. Got a question or a hot take on copper vs. silver sintering? Drop us a note and join the conversation.

Henkel Semiconductor Packaging Materials
Henke's advanced materials elevate semiconductor packaging to meet power, performance, area and cost

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Chapters

• 0:00 Setting The Stage: Power Electronics
• 2:32 Defining Power Semis Versus Electronics
• 6:10 Why Demand Is Exploding
• 9:20 Wide Bandgap Advantages And Tradeoffs
• 12:10 Packaging Priorities In Power Devices
• 15:10 Discretes Vs Modules: Challenges
• 19:20 From Solder To Sintering
• 22:15 Cost Pressures And Silver Alternatives
• 25:00 Copper Sintering: Process And Proof
• 28:00 Roadmaps, Qualification, And Scale
• 31:00 Partnering With Customers Globally

Transcript

Françoise von Trapp: 0:26

Electronic technology. Hi there. Hi everyone. This week we're talking with Rom Tricher of Henkel Corporation on the topic that we haven't really explored before, and that is power electronics. Now, this sector of the microelectronics industry is projected to become a 67.5 billion market by 2030. And Rom is here to talk about what's driving that growth and how to get there. Welcome to the podcast, Rom.

Ram Trichur: 1:13

Hey, very nice, Francoise. Long time since we last spoke. Thanks for having me again.

Françoise von Trapp: 1:18

Yeah, and you've been on before. So for those who maybe haven't heard you, can you just remind us of your role at Henkel and your background a little bit?

Ram Trichur: 1:26

Yes, my name is Ram Tritur. I head the semiconductor packaging segment in Henkel. My background is I'm an electrical engineer at heart and training. I started my career as a hands-on engineer and then moved on to a more uh uh market strategy and business development uh roles more recently. And then I joined Henkel roughly around uh seven to eight years ago and been heading the semiconductor practice segment.

Françoise von Trapp: 1:59

I remember when you were at Brewer Science.

Ram Trichur: 2:02

Yes, yes, that was my previous employer.

Françoise von Trapp: 2:05

Yeah, and I remember when you brought Henkel into 3D Insight. So thanks for that.

Ram Trichur: 2:10

Yeah, much appreciated. Always love the podcast series and then all the other things that you do in your website.

Françoise von Trapp: 2:18

Thanks. I was thinking about this last night, and you know, I toss the word around all the time, like I know what I'm talking about, and I know power electronics and power semiconductors are important to automotive applications. But what exactly are they? And there is there a difference between power electronics and power semiconductors?

Ram Trichur: 2:38

So power semiconductors are the ones that uh power all the power electronics. That's one way to say it. Yeah.

Françoise von Trapp: 2:45

You're using the same words to describe what they are.

Ram Trichur: 2:49

So there is an IC at the heart uh that is either a silicon-based or it is a white band gap semiconductor based. And often that I see is is like a switch, a transistor, and it also is accompanied by a driver, and they both uh work together to uh power on and off and uh convert voltages and uh uh step ups or or uh you know converted into AC, DC, step down the voltages, all those functions are done by power electronics. Basically, any kind of power conversion is aided by uh these power semiconductor devices.

Françoise von Trapp: 3:31

Okay, so they need an integrated circuit, and I see. But are they super smart? Do they need to be super smart?

Ram Trichur: 3:39

Yes, they they there are intelligent power modules now, they have additional functions integrated for these power conversions. Yeah, so um there is uh not just the conversion but also added intelligence.

unknown: 3:54

Right.

Françoise von Trapp: 3:54

So there's a difference between like your light switch that goes on that you go on and off. Does that require a power device in there?

Ram Trichur: 4:02

A light switch is more of an electrical device, uh, but if you take the diode, that is a power device, an LED, for example. Okay, that is a diode.

Françoise von Trapp: 4:14

So don't equate electrical with power in this case.

Ram Trichur: 4:17

The big chunky boxes, yeah, don't equate that with uh power semiconductor. Yeah.

Françoise von Trapp: 4:22

But a power semiconductor requires electricity, like all semiconductors, to function. So give me an example of an application for a power semiconductor.

Ram Trichur: 4:33

Let me try to relate this in terms of what we normally talk about. So we normally talk about advanced packaging.

Françoise von Trapp: 4:41

Right.

Ram Trichur: 4:41

We talk about data processors, uh, we talk about application processors, all that. So there, the majority function of those processors uh is to enhance that data, convert that data into uh uh usable output, but more like uh logic and memory functioning together to process the data. Yeah, right. Give us intelligence output. So in a some power semiconductor device, there is actually no data ones and zeros or things flowing there. Yeah. Okay. It is really turning on and off something. Um, it's uh conditioning your power, stepping up your voltage, stepping down your voltage. Um, those are, I would say, a major difference between a uh logic device and a power device.

Françoise von Trapp: 5:34

Okay, so that makes sense. Thank you for clearing that up. That's why when we have thermostats that are now smart thermostats, they not only have power, do they have power devices in them?

Ram Trichur: 5:44

They have power devices and they have sensors, they have uh also have logic. So, and they have display drivers because it comes with an integrated display. So that's a complete system, that thermostat.

Françoise von Trapp: 5:59

Okay. So now that we understand what power electronics and power semiconductors are, let's talk about what's driving this growth of it says up to 67.5 billion by 2020. What's driving that?

Ram Trichur: 6:14

Yeah, so the power electronics market, I would say, is going through a really exciting uh transformation uh right now, uh, driven by uh increasing demand for energy efficient solutions across many verticals like mobility, industrial, uh data center, communications, mainly due to rising environmental concerns and also uh stringent energy regulations by many countries. I would say there are several key trends. First is uh electrification uh that's kind of accelerating everywhere, not just in electric vehicles, uh, but also in uh transportation, I would say also renewable uh energy systems and also industrial applications. So it's creating a huge demand for uh more efficient, higher power electronics that can handle stresses of these extreme applications. And then uh, secondly, what I would say is uh wide-band gap semiconductors like uh silicon carbide and gallium nitride are actually a game changer for power electronics. Uh, these are materials that allow devices to uh switch faster, operate at uh higher voltages, and also run at high temperature, meaning compared to a traditional silicon, when people move to a wide band gap semiconductor like silicon carbide or gallium nitride, they can have smaller, lighter, and more energy efficient systems. And then the third one uh is I would say uh push for higher integration and power density. So we're seeing more compact power modules uh combining functions in the same package to reduce size and uh losses. These are used in data centers, EV chargers, and also uh sustainability and efficiency are also becoming uh non-negotiable. Yeah, so uh to manage uh stricter efficiency targets, uh thermal challenges, cost pressures, uh, those are some of the key drivers uh that uh moves forward power electronics devices.

Françoise von Trapp: 8:36

So power electronics can help us make power use more efficient if they're built properly. And that's one of the reasons we're moving from silicon-based to compound semiconductor based, right?

Ram Trichur: 8:48

Gallium arsenide and uh silicon carbide, gallium nitride, yeah, white band cap. So traditional power electronic devices are bulky. Uh so let's say if you you take a car, an EV, one of the major uh impetus in EV is having longer range. Yeah. If you add uh weight and volume with these bulky electronics, now you're shortening the range. So moving to uh uh more efficient power conversion systems with uh silicon carbide-based inverters reduces the weight and volume, hence increasing the efficiency of the power electronics and the end device in terms of uh uh mileage.

Françoise von Trapp: 9:32

You said before that the wide band gap semiconductors run at higher temperature. Because I thought like we wanted things to be cooler, because if things run at higher temperatures, then we have to do all of this cooling.

Ram Trichur: 9:44

So these silicon carbide and uh a gallium nitride, if they operate at higher junction temperatures, they perform their functions more effectively instead of lower temperatures, so they can provide faster switching speeds, and they are also smaller in size, so they pass a much higher electrical flux through the small dimension. So naturally, um, there is a lot of heat flowing through it, and thereby comes the need for higher thermal conductive dietch materials, meaning hey, a traditional solder may not work in these high heat flux conditions. So we need to switch to more centered dietch materials to conduct this heat away from the device.

Françoise von Trapp: 10:35

Okay, so we're improving the efficiency and the performance with these wideband gap materials, but now this is creating some other challenges where which are actually right in Henkel's sweet spot, right? To address.

Ram Trichur: 10:52

That is correct.

Françoise von Trapp: 10:54

From a packaging perspective, is thermal management one of the challenges that you have to address?

Ram Trichur: 11:01

Only, I mean, that's one of the big challenges. So if if we're looking at a packaging from a packaging perspective, it also helps to look at it from two angles because power conversion devices fall under two categories power discreet and the power modules. Yeah. Power discrete devices are really individual dice packaged in a discrete package. It may contain a driver, but it's mainly one switch. These are like power MOSFETs or IGBTs. Um, so in power discrete devices, we are seeing a major shift, like I said, towards wideband gap semiconductors such as silicon carbide or gallium nitride. And the key challenge here revolves around managing higher power densities, higher operating temperatures, and faster switching speeds while maintaining cost effective and high volume manufacturability. So we'll we'll come back to hey, how are we addressing this cost effectiveness? Yeah. So in this space, uh, there is a clear need for uh next generation dye attached materials to replace traditional solders that are used in silicon-based uh power electronics devices. We're also seeing a move towards uh thinner dice, uh, which again improves the efficiency, but it also increases the thermal and mechanical stresses on the package. Uh, we are also seeing a growing trend of uh using copper lead frames to improve uh thermal performance and while keeping costs under control. When it comes to power modules, um, the challenges scale up because these operate at much higher voltages, and then the EV power modules are moving from uh a traditional 400 volt system to now 800 and even beyond 1000 volts. Yeah, the use of uh silicon carbide dyes are becoming mainstream in EV power modules, and now manufacturers have to balance power density, reliability, manufacturability uh while addressing uh thermal performance. So I would say again, in power discretes and power modules, the the challenges are along the same flavors. How do you manage cost, reliability, thermal, uh, while uh switching from a traditional silicon-based to uh wideband gap-based semiconductors?

Françoise von Trapp: 13:30

Okay, so one of the things we've been talking about a lot in the advanced packaging side is that the purpose of packaging is shifting from the protection of the device to the interconnect and the importance of you know higher density interconnect. So it seems to me though that this is not the issue in the power space. Packaging still plays the traditional role that it has always played.

Ram Trichur: 13:55

That is correct. Yeah. Here it's not a matter of I/Os, these are all traditional wirebond packages. So we're not talking about high density I/Os, uh shrinking pitches, shrinking gaps. No, that's that's purely in the advanced packaging side. Uh, here we are uh dealing with uh mainly thermal warpage, uh, conductivity, high power, high current, uh, which is unlike a logic situation.

Françoise von Trapp: 14:24

Okay. So it's interesting though to have this conversation because sometimes people think that we are moving away from traditional packaging. But the reality is traditional packaging is still very much alive and probably still accounts for maybe, I think, like 80 to 85 percent of what's being manufactured these days, right?

Ram Trichur: 14:44

Totally agree.

Françoise von Trapp: 14:45

So we get so focused on the advanced innovations that get talked about. Like we don't see hybrid bonding here. So we're not even seeing flip chip here.

Ram Trichur: 14:53

That's all traditional wirebond packages. So in Henkel's portfolio, yeah, we are one of the leaders in uh uh dye attached materials. So a lot of this business in wirebon packaging is our core business. So when we think of this wirebon packaging business as a core business, we see power modules and power discretes as an extension of our core or as a growth area within our core wirebond business. So it's not a mature segment, but this is indeed a growth segment because of the shift from traditional silicon-based uh power conversion devices to silicon carbide and gallium nitride-based power conversion devices, and all the underlying trends pushing the volume of these wideband gap devices, we see this as a growth area. Because if it's a silicon-based, it's traditionally addressed by solder, and that is not one of the materials that Henkel carries anymore. So for us, this entire opportunity is a growth area, just like how we perceive advanced packaging as a growth area. Anything in high thermal dietch and sintering materials tied to power electronics is a growth area.

Françoise von Trapp: 16:08

So we still need massive innovation in the power electronics space when we're shifting from silicon to wide band gap material. We're looking again at having to create devices that are lighter, that have cooling issues to handle, um, dealing with different sorts of substrate materials. So if we're still using wire bond processes, we must be needing to also innovate there if we're handling smaller dye, right?

Ram Trichur: 16:38

That is correct. So innovation goes hand in hand with any of the new growth areas. So here, like I said, um cost is a big factor uh for people in the power electronics industry. Yeah, when you move from solder to a sintering material, solder is a uh a cheaper alternative. When you go to centering, it's usually made with the silver-based material. So instead of paying for solder, now you have to pay for silver in that same bond line. And if you if you've noticed how much silver prices have gone up in the past few months, you don't want to pay for silver for it. Okay, so there is a big opportunity for Henkel and companies like Henkel in this space to offer alternate for silver-based pressure centering or silver-based centering material. So here Henkel is investing quite heavily in uh uh a roadmap for copper-based uh centering material. So that's that's one of the innovations um that is supporting a um uh cost pressures uh for our customers.

Françoise von Trapp: 17:47

We've just been talking about a few of them. What about some of the other customer pain points you can talk about that Henkel tries to address?

Ram Trichur: 17:54

Yeah, so our customer pain points again tend to fall into several consistent areas. Okay. Uh, first and foremost, it's reliability. Power semiconductor devices and modules need to perform flawlessly for multiple years in high voltage, high temperature operations, often in very demanding environments that are found in electric vehicles or industrial equipment. And then another key challenge is the compatibility with a wide range of die sizes and backside metallizations that are in these dice. With the shift to wideband gap semiconductors, the packages must accommodate thinner dies, often strange geometries like the very slim rectangular dies that we commonly see in telecom applications. And also thermal performance, like I said, is always critical. Uh, die attached and centering materials need to manage heat quite efficiently, um, and then also offer very specific range of thermal conductivities depending on what is the package, what is the uh device type, and also specific bond line thickness. And lastly, like I said, cost optimization, supply stability are also on top of the mind for our customers, as uh all these manufacturers need to ensure reliable uh production runs without any unexpected delays. And and beyond all this, technical and operational concerns, our customers are also looking for partners with foresight, which is hey, do you have a strong innovation roadmap and ability to anticipate what we need in our next generation of semiconductor banking? So they don't want only solutions for what their needs are today, but they want it to be future proof and we they need suppliers to uh support a uh roadmap uh beyond uh what it is visible for the next few years. So that's where Henkel uh strength is. You know, like I said, we've been in the wirebond and dietch for a very long time, more than 50 years. Um, so customers value this expertise, and uh uh we're also very glad that they come to us uh for these uh uh roadmaps.

Françoise von Trapp: 20:16

Good thoughts. First of all, uh you were talking about the cost of silver, and that made me think about the geopolitical issues with rare earth minerals. Um, and how is that situation impacting Henkel's ability to deliver to their customers with a consistent supply of the materials that they're looking for?

Ram Trichur: 20:38

Yeah, silver is not a mineral that's um gate-checked um in any of these uh geopolitical issues, uh, but silver is a precious metal and the costs are increasing, and there's a lot of surprises in the market. Uh, like I said, it's been volatile um uh with high peaks and sudden dips in the last uh uh several months. Yeah.

Françoise von Trapp: 21:04

What about copper?

Ram Trichur: 21:05

Copper is a much more general traded metal, yeah. So it's uh much cheaper than silver. Um, so that's a uh alternative uh that people consider as quite viable. But copper has not yet been used as a dietch material uh yet. Okay. Um, so there is a lot to be proven to say, hey, copper is a viable alternative. But already in our innovation efforts, we've uh sampled this to multiple customers, and all the tests are proving quite strong in terms of uh reliability data, processability, all that. Uh, we do expect with all the new innovations that's happening now, copper will be a very viable replacement for uh silver in the near future.

Françoise von Trapp: 21:52

When you're talking about your development roadmap, one of the things I do know about materials and microelectronics is that to qualify in a new material takes a really long time, and customers will stick with what they have for as long as they can because it's such a big deal. So, how far out do you have to consider when you're doing your roadmaps for these kinds of things?

Ram Trichur: 22:18

Yeah, so we plan for five to 10 years out for a roadmap because in semiconductor packaging, you start an innovation now, you get a qualification probably three to four years later, if you're lucky and everything goes on. Yeah. Um, and so there needs to be a lot of patience for both the customers and the uh suppliers to take part. So that that goes through for also power semiconductors. And then we have innovation investments in to address both the power discreet and also uh power modules. Uh, maybe I can talk a little bit about what we're doing in uh power discretes and power modules and we can expand on it. Yeah. So for power discretes, like I said, again, the major shift is uh going towards silicon carbide and gallium nitride, and also addressing uh larger dye sizes up to eight by eight, for example. So we have uh large dye pressureless sintering materials in our roadmap. And then, like I said, customers want to convert to copper lead frame. So we have uh pressureless sintering materials that are compatible with copper lead frame, and also if uh customers move to uh thin dyes in these power discreets. Now we're investing in uh uh film-based approaches, uh dispensable approaches for dietch, these pressure sintering dietch materials to be compatible with thin dye. Because as dye is thin, you don't want the dye attached material to creep back up onto the top. So you need some formulation modifications or format modifications to be compatible with thin dye. And then also, like I said, there there needs to be customized thermal conductivity for different packages. So if a solder is being replaced, um, the thermal conductivity of solder is anywhere around uh uh 20 to 50 watts. So if solder is being replaced with a sintering material or a high thermal dietch, people are expecting 50 to 100 watt-based um dietatch material. So here also we're we're having pressurless sintering material as well as uh our epoxy-based diet hatch expanding in thermal conductivity to 50 to 100 watts. So these are some of our innovation investments in uh power discretes, again, addressing large dye, copper lead frame, thin dye, multiple uh BSMs, backside metallization in uh in dyes. And then if you take power modules, now traditionally I said like solder has been used. And then when it moves to higher voltages, silver-based pressure sintering has been used in power modules. So now what Henkel is really trying to intercept is the next inflection. Silver is too expensive, we still need a sintering die attached material. Henkel is investing in pressure-assisted copper-based sintering dye attached material. Um, so these are micron-based copper that can bond the dye to substrate bond line, and also another bond line below the substrate and base plate, which which we call as large area centering. So two bond lines. One is dye to sub with the copper-based centering materials, pressure centering materials, and then substrate to base plate with the copper-based pressure centering materials. So these are uh the uh portfolio that we have in innovation, and we're engaging with the all the top-tier customers that are doing both the discrete semiconductors, power semiconductors, as well as the power modules.

Françoise von Trapp: 26:01

So, with copper difference from silver in the processing, you do have to deal with the potential for oxidation. Correct? Correct. So, is there something specific about the tools for the dietch? If they're going to be using copper material to do dietch, do the tools have to have a special environment to reduce the amount of um oxidation that can happen?

Ram Trichur: 26:26

Yeah, that's a great question, Francoise. Yeah, so in our uh copper-based pressure sintering material, the formulation itself is stabilized with special ingredients. So there is uh not oxidation happening in the formulation. And when we do the uh actual sintering diet, it is conducted in a nitrogen environment, and where we actually offer value to our customers is the sintering happens at much lower temperatures around 225 degrees C, and then at also lower pressures around 15 to 20 megapascals. So that's how we uh do the copper-based sintering materials and attach it to the dye.

Françoise von Trapp: 27:12

Well, that's very cool because that means you don't have to consider all of these other things like special surface treatment before or protective coatings.

Ram Trichur: 27:21

That is right.

Françoise von Trapp: 27:22

So this is really interesting. Is this something that is available to your customers already? That is correct. Or is it in development?

Ram Trichur: 27:29

That is correct. It is uh available to our customers, it's in development, but samples are available to the customers. This is not a commercial product, but we're uh sampling uh widely to our uh target customers um for this uh pressure assisted centering.

Françoise von Trapp: 27:45

So when you are doing sampling to your customers, this is part of the process to qualify the material that is correct into so that you can then bring it into production.

Ram Trichur: 27:54

That is correct. We engage with our customers at the early design phase, and um this inflection is something that we predict that will happen. So we sample very early the customers and they have a long qualification cycle, like I said, multiple years.

Françoise von Trapp: 28:10

And by the time they're ready to implement it, you've got it taken care of.

Ram Trichur: 28:16

That is correct. Yeah, I mean, we obviously need a first customer to take it to the finish line. So that that'll be our launch. Right. And then once we launch it, we scale the multiple. And if there are formulation tweaks that are needed uh for other customers, uh, we we are very capable of making those.

Françoise von Trapp: 28:34

Are customers willing to be the guinea pig?

Ram Trichur: 28:37

Yes, because always customers look for new technologies because it gives them certain advantages in the marketplace. If if they are uh having devices um that are made more cost effective, if they are having devices that are made more operationally friendly, like in this case at a lower pressure and a lower temperature, these gives them advantages. Obviously, all these devices need to be at least as good or better in terms of reliability compared to previous generations. So if we offer all those advantages with uh process and cost uh benefits to our customers, they're willing to try that.

Françoise von Trapp: 29:18

So if a customer wants to engage with you to be part of this, how would they go about doing that?

Ram Trichur: 29:25

We have a very good assessment of the market. So we know who are the target customers, who are our strategic customers, who will have uh a big impact uh in terms of uh business as well as volumes. Um, so we knock on their doors, we work very closely with them. Obviously, uh, if we miss someone, we invite enquiries and uh we have a way to feel this uh uh throughout uh the world. Yeah, we have uh uh sales offices, uh engineers, so very easy uh for our customers. Reach us. I don't think there is a single customer that we we are not knocking on the doors of or we're not present, but yeah, very easy to reach us.

Françoise von Trapp: 30:08

So Hankel is a global corporation and you have many different divisions. Where are most of the electronic materials manufactured?

Ram Trichur: 30:16

So our electronic materials are manufactured in uh uh US. We have a facility in Rancho, uh, we have a facility in uh China near Shanghai, uh, we have a major plant in Korea and also in uh Japan. I would say these four sites are our major manufacturing sites, uh, but Henkel has other facilities that we can also turn on if needed.

unknown: 30:42

Okay.

Françoise von Trapp: 30:43

Any final thoughts that you wanted to share today?

Ram Trichur: 30:47

Yeah, I mean, I want to end this on a uh positive, uplifting note because uh as we look ahead, I see power electronics market is growing faster than ever due to uh electrification and adoption of these wideband gap semiconductor devices. Uh, this this growth creates exciting opportunities for everyone in the value chain and uh Tankel, we're uh very proud to invest in uh uh continuously in this innovation, offering our broad market-proven portfolio of uh materials uh for diet and also centric. So uh looking forward, there are even more opportunities uh for material innovation as the devices become more powerful and uh the systems push the limit of thermal and electrical performance. And I uh want to thank our uh partners because uh our success comes from strong partnerships uh with our customers, upstream raw material suppliers, equipment partners, and uh broader ecosystems. So I feel together we can tackle uh the toughest challenges and uh bring new solutions to the market faster.

Françoise von Trapp: 31:58

Well, thank you so much for your time today, Ram. I really appreciate it. It was really interesting learning a little more about power electronics and Henkel's role in it.

Ram Trichur: 32:07

Hey, thank you so much, Francois. It's really a lot of pleasure talking to you all anytime.

Françoise von Trapp: 32:16

Coming up next on the 3D Insights podcast, I talk with Nietza Bosoko, Julia Goldstein, and Ann Meiksner, three women who are semiconductor industry professionals. They all contributed chapters to a new book, Empowering Women in STEM Pioneering Paths to Shape the Future. They share their journeys, what makes them passionate about technology, and how they are paying it forward. There's lots more to come, so tune in next time to the 3D Insights podcast. The 3D Insights podcast is a production of 3D Insights Lake.